The temp issue only affects us enthusiasts that actually bought a K type processor for the sole purpose of overclocking, not so for the common user who only use their PC for Facebook or Angry Birds. Since there are more who don't dabble with overclocking, you could almost say that the temp issue is almost nonexistent hence swept under the rug. Without a competitive product from AMD, there is no urgency for Intel to make their product more receptive to the mainstream users.Possibly? The fact that IB bets hot is now known even to non-geeks, so addressing that might make people more receptive to their product?
Admit it, Intel could just solder the die to the IHS, release it as the 3870K and we'd wet ourselvesWhy doesn't intel resolve this issue already when they could shave off temps in the double digits just by changing the TIM with something better?
Admit it, Intel could just solder the die to the IHS, release it as the 3870K and we'd wet ourselves
Would shaving off temps in the double digit with solder = more money in Intel's coffers?
Exactly, that was my point. Intel caters to the bigger crowd, which happens to be mainstream users who don't overclock or don't know how to overclock.I think it would with the K series because enthusiasts/overclockers buy them. With everything else? Probably not.
So then they should use the soldering method for their K series...
Under Prime load:
4.5Ghz - 1.216v
4.6Ghz - 1.264v
4.7Ghz - 1.312v
SuperPi runs:
4.8Ghz - 1.312v
4.9Ghz - 1.352v
*updated*
I delidded mine on 8/12/12, posted in a thread on Hardocp. Used IC diamond under the IHS.
Temps are the same 2 weeks later after testing. Not long enough to make any conlcusion, but I'll update again in a couple more weeks to see how it is doing.
3 weeks in temps are back to pre-mod level with IC diamond. Hopefully they stop there and I don't have to reapply like Ferzerp, but it's not looking good.
I wonder if anyone has tried this with the IHS walls trimmed away? It seems to me that a fixed height of the IHS and thermal cycling would explain this.
pwoz said:3 weeks in temps are back to pre-mod level with IC diamond. Hopefully they stop there and I don't have to reapply like Ferzerp, but it's not looking good.
I wonder if anyone has tried this with the IHS walls trimmed away? It seems to me that a fixed height of the IHS and thermal cycling would explain this.
I will if I don't get Liquid Pro/Ultra before that time. I'll do a Prime Blend for 30 minutes at a known frequency and voltage today and post the maximum temperature results, and then I'll come back to it two Mondays from now (and maybe three, then four, etc.) and do the same thing if I don't upgrade to the liquid metal TIM before then.
Yuriman said:Which TIM should I use for between the die and the IHS, and which for the IHS-> heatsink if I'm concerned about longevity? I'm not keen on the idea of having to reapply every few weeks. Has anyone had any longevity issues with liquid metal pro, or will it last a really long time? I currently have a tube of HeGrease Extreme which was reviewed pretty well by a few sites but I realize some of these other pastes are probably significantly better.
Last I saw . . . you were using the IC Diamond? I can't recall what FerZerp was using.
Definitely doesn't. I asked Arctic Silver way back in the day, and they ended up sending me 50 tubes of AS to use for our HSF testingYes, I am using IC Diamond. I just sent an email to Xoxide letting them know the testing that I'm doing in the hope that I can get some Liquid Pro and/or Liquid Ultra and post results using those. I figure if they are gracious enough to send it to me for free or at least give me some free shipping then I'll have results for everybody to see, and possible customers to send their way. Never hurts to ask, I guess?
Would anyone be willing to leave it for longer than 2-3 weeks instead of reapplying to see if it will degrade even more?
Thermal Cycling/TIM Failure Test
System Info:
3570K Delidded with IC Diamond between the die and IHS
ZT-10D HSF with Arctic Silver Ceramique between the IHS and the HSF
4.5Ghz @ 1.232v (after vdroop)
Delidded and IC Diamond applied 8/29/2012
After one week:
(9/4/2012)
Ambient temp - 25C
3570K max temps after Prime "blend" for 30 minutes - 67C, 76C, 74C, 73C
More results to come...
I'm not sure you really need a long term test. When mine has issues, I see it within 5 seconds of starting up IBT even on the default settings. It's not an issue of cooling system heat soak (which long runs will show), but instead is a heat transfer issue, and so is pretty immediate when it happens.