- Jun 30, 2004
For the diamond stuff, you'd think that a month or two would be a good enough profile, with shutdowns, cooling down and cold starts.I understand that, but I'm wondering if there is a any "slow degrade" pattern to it if the transfer ability is observed over a long period. I get that once it's reached the "failure" point it will take just moments for the temperatures to spike.
Was it better than that after you first ran it with the IC diamond? These numbers don't look half-bad, and your choice of a heatsink . . well, I searched for a comparison review:dqniel said:Thermal Cycling/TIM Failure Test
3570K Delidded with IC Diamond between the die and IHS
ZT-10D HSF with Arctic Silver Ceramique between the IHS and the HSF
4.5Ghz @ 1.232v (after vdroop)
Delidded and IC Diamond applied 8/29/2012
After one week:
Ambient temp - 25C
3570K max temps after Prime "blend" for 30 minutes - 67C, 76C, 74C, 73C
More results to come...
. I suppose that could be right in a 77F room ambient. You wonder which groupings of two or three are more accurate over a fourth outlier. The sensors are supposed to be accurate within a range, + or -.
Those temperatures are maybe 6 or 7C above my Sandy's at 4.6. But your IB is more heat tolerant, at least relative to the given specs.
Suppose it stabilizes, or remains the same. You might then want to apply some more ICD to the bottom of the IHS to see if it improves to a new stable set. Or so it would be my own inclination, if I were de-lidding an IB like yours. Of course, the cost rises a bit more steeply given the price of the diamond paste.
Eventually we're going to start making sound conclusions about it.