Azix
Golden Member
- Apr 18, 2014
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I thought it was the physical package that was reduced in height,but it seems they actually reduced the height of the actual wafer itself.
I was wondering about this. On the AMD site they mentioned
To enable the thinnest graphics processor possible, AMD also employs a complex process known as 'die thinning' to reduce the thickness of each wafer of silicon used in the processor from 780 microns to just 380 microns, or slightly less than the thickness of four pieces of paper.
which suggests it wasn't just the power etc that made them go with AMD, but also the physical chip dimensions. should this not be in the desktop polaris 11 (rx 460)? My assumption was these MBP gpus are the same as rx 460
