And the i9 12900HX is a Mobile CPU isn't?"Highest core count for a mobile cpu" does not imply >16c, it just implies 16c. AMD made that phrase very carefully, read it again
AMD claims dragon range has highest core count for a mobile cpu. And what's the highest core count for mobile cpu? It's 16. So DR has 16 cores, simple.
What is the misspelling? I have seen official slides with misspellings. This could be a leak from an OEM source; perhaps something for laptop makers. They may have been less careful with something that wasn’t meant for wide distribution.
It's an official slide given to only a handful of the press from AMD directly. Also, it's very common to find typos in AMD's slides lol.
Not really. Every competitor has to run predictions where the market and competition is years in advance. Closer to launch there can't be fundamental changes to the plans anymore, only to aspects of the launch execution like timing (staggering), pricing (segmentation), targeting as well as allocation of chips to different markets.
Just so we have this in pixels:
And You can bet their Mobile i9 HX Raptor Lake CPUs will be 24 Cores because Raptor Lake i9s will also be 8P + 16E
AMD is not even Acknowledging Intel's big/Little core.(at least has not acknowledged that recently).
That has been true in the past, but with AMD’s flexible, modular architecture using MCM and/or stacked die, they can change up their products much more quickly. I am still wondering if the desktop IO die actually has 3 IFOP to keep a 3 cpu chiplet version an option. There are also may be more than one type of cpu chiplet available with the Zen 4c derivative. I have been assuming that it will be a stacked die, so it probably can’t be used with a standard mobile or desktop IO die, but it may not be stacked or they may have built some other modularity features into it allowing it to be used elsewhere. The EFB tech, if used similarly to the way the Apple M1 Ultra is built could add another level of flexibility and modularity by allowing multiple APUs or even multiple IO die to be connected together with very low power consumption.
They will likely be stacked devices using SoIC or EFB rather than MCMs connected by serdes links. That takes too much power. The chips used in MCMs should never have been called chiplets really. That should have been reserved for packages using at least 2.5D or 3D stacking. An MCM is just multiple chips on a single package although they may be using some more advanced packaging technology in some cases that are not stacking but not a simple MCM either.
It's still true today. Yes, AMD is more flexible using its different multi chips approaches. But those designs still needed to be planned well beforehand to reach that point.
I'm starting to think Raphael-H alias Dragon Range is the APU gone chiplet which will see further mobile oriented optimizations in later gens. I still doubt it will replace lower cost monolithic APUs though.
wccftech.com
15-24% IPC Increase (Over Zen 3)AMD Ryzen 7000 'Raphael' Desktop CPU Leaks Out: 8 Zen 4 Cores, 5.2 GHz Max Clocks, RDNA 2 'GFX1036' Integrated Graphics Clocked at 2.0 GHz
AMD's Ryzen 7000 'Raphael' ES Desktop CPU has been spotted with 8 Zen 4 cores clocked at 5.2 GHz & RDNA 2 iGPU at 2.0 GHz.
8-14% Clock Increase (Over Zen 3)
28-37% ST Perf Increase (Over Zen 3)
videocardz.com
www.computerbase.de
So back on APU topic.
In part due to rumor:
And if you consider Intel's Meteor Lake the main competitor for Zen4 will feature iGPU with 192 EU that puts it in striking range of RTX 3060MAMD Phoenix RDNA3 iGPU could be as fast as the slowest GeForce RTX 3060 mobile GPU - VideoCardz.com
AMD Phoenix APU with mid-range discrete GPU performance Greymon55 claims that the upcoming integrated graphics into the AMD Phoenix APU, could show comparable performance to the most power-restricted version of the RTX 3060 mobile. AMD Ryzen 7000 series will officially include two mobile series...
then AMD would be incompetent and stupid not to see ahead and pull along likewise.
wccftech.com
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