AMD 2800x with 10 Cores spotted

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NostaSeronx

Diamond Member
Sep 18, 2011
3,770
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If it's 7nm it's not Ryzen 2k. There would be a lot more different than just a die shrink.
They might want to save Ryzen 3000s for DDR5.

Another speculative:
2870(X) => 16-core Zen2 w/ DDR4
2850(X) => 14-core Zen2 w/ DDR4
2820(X) => 12-core Zen2 w/ DDR4
2800(X) => 10-core Zen2 w/ DDR4

At that point Ryzen 3K might as well be based on Milan.
https://www.anandtech.com/show/12710/cadence-micron-demo-ddr5-subsystem

This way they wouldn't have to do Ryzen 3K two times. Once for X470/B450 and another for X500s/B500s.

AMD is longer hampered at the 7nm FinFET plus node either. So, they can hop onto the 5nm FinFET at TSMC. Since, early on this year GlobalFoundries said they weren't going to do 5nm.
Ryzen 2800s => 7nm FinFET
Ryzen 3000s => 7nm FinFET+ or 5nm FinFET (7nm FinFET to 5nm FinFET all being the same node; standard cells are compatible. Full EUV with the most relaxed PDK do to less complexity.)
 
Last edited:

Gideon

Golden Member
Nov 27, 2007
1,908
4,612
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I particularly like this explanation from reddit, why not to put trust into such cinebench scores. Courtesy of -Viktoria

-Viktoria said:
Dunno about this one, Cinebench scores can be very easily edited in any text editor.
oZnXWuT.png
 
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Reactions: NTMBK

Topweasel

Diamond Member
Oct 19, 2000
5,437
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NB: I still think this is fake.



7nm insurance design.

You have your 7nm design, you go all out on this - 8 core CCX, 16 core dies, 64 core Epycs.

But ... in 2016 and 2017 AMD didn't know that TSMC would pull through on their 7nm promise in H2 2018. But they needed Epyc 2 by Q1 2019.

So you design a 12nm backup. You have power and die size issues here, you cannot go all out like with the 7nm design. So you go for a 6 core CCX, 12 core dies, 48 core Epyc 2. This 12nm was likely taped-out and probably had some silicon spun.

This fits with some rumours that it would be 48C initially.

But then GlobalFoundries tell you they won't be doing 7nm (initially this was probably a strong hint, or saying it will be late, or similar). Or TSMC say that Apple bought all the space. Result: your booked Zen 2 runs at TSMC cannot cover all of your product need for consumer space.

7nm consumer Zen 2 is put back, H2 2019 say. Not a disaster to wait that long really, but right now, Intel is hurting on their 10nm process, and don't you just want to stick the knife in?

And you have a 12C Zen or Zen 2 based 12nm die, and you also need to make stuff on GlobalFoundries because of wafer agreement. And you also want to have something to compete in some metric (i.e., multi-threaded performance) against Intel's 8C consumer chips coming in Q4.

So you leave a space in your line-up just in case you need a 2800X later in the year. You get a thousand wafers of your new design fabbed, you fuse off some of the Zen 2 features for next year's products. You package up the samples and send them out to OEMs and partners.

Given that timeline, I'd expect to see initial leaks happening right about now.

NB: I still think this is fake.

That's just silly and for 12nm, AMD made the transition and barely one at that because it took minimal effort to move over to it instead of just another 14nm proccess and they spent no time in right sizing the die and just allowed more black space (not in the way their diagram shows but the point still stands). They wouldn't have done that if they were spending the whole time designing a secondary die that is now shuddered and they certainly wouldn't go through the testing and validation prior to sale for something they basically would only have one step above engineering samples to sell. AMD created the die they wanted in PR. It's out and we know what it is.

They might want to save Ryzen 3000s for DDR5.

Another speculative:
2870(X) => 16-core Zen2 w/ DDR4
2850(X) => 14-core Zen2 w/ DDR4
2820(X) => 12-core Zen2 w/ DDR4
2800(X) => 10-core Zen2 w/ DDR4

At that point Ryzen 3K might as well be based on Milan.
https://www.anandtech.com/show/12710/cadence-micron-demo-ddr5-subsystem

This way they wouldn't have to do Ryzen 3K two times. Once for X470/B450 and another for X500s/B500s.

AMD is longer hampered at the 7nm FinFET plus node either. So, they can hop onto the 5nm FinFET at TSMC. Since, early on this year GlobalFoundries said they weren't going to do 5nm.
Ryzen 2800s => 7nm FinFET
Ryzen 3000s => 7nm FinFET+ or 5nm FinFET (7nm FinFET to 5nm FinFET all being the same node; standard cells are compatible. Full EUV with the most relaxed PDK do to less complexity.)

Sure they could also call it something completely different or try to jump over Intell and call it the 10700X. AMD has defined their naming scheme and has set precedence with Ryzen 2k. If Zen + is named Ryzen 2k, then Zen 2 is going to be Ryzen 3k.

Both of these suffer from the same issue. People who know so much that they can think about all the possible solutions but it ignores the two most important parts. 1. The general reality of AMD's situation. B.) What is mostly likely.

A 2800x might come out but its not a 10c part. I could buy something like a 10c TR2 but it would be numbered like a 2915X and would break a lot of rules regarding CCX parity. But that one is feasible even if it will never happen.
 
Mar 11, 2004
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While I agree likely fake, there are other explanations. Like AMD experimenting with new packaging (putting two dice on one Ryzen socket chip, maybe there's some extra layer, like an interposer or something, as AMD is trialing a new one, possibly looking to make a bigger APU where they put a sizable GPU on there along with a full 8 core CPU die, or maybe they'd look to add HBM or something to function like a larger cache, or perhaps its a start on their "chiplet" design - with Ryzen being probably more advanced in this respect than their current GPUs due to having InfinityFabric - with the exception being Vega which is almost certainly too large to be able to do something like that).

This lets them try it out and if it works well they can release it as a real product, and it'll cause waves. If it doesn't then they don't release it and just use it for internal testing (maybe offer it as a trial solution for people that want to adopt EPYC, but need to see how they can work with the inter-die stuff before they make the full jump).

They might want to save Ryzen 3000s for DDR5.

Another speculative:
2870(X) => 16-core Zen2 w/ DDR4
2850(X) => 14-core Zen2 w/ DDR4
2820(X) => 12-core Zen2 w/ DDR4
2800(X) => 10-core Zen2 w/ DDR4

At that point Ryzen 3K might as well be based on Milan.
https://www.anandtech.com/show/12710/cadence-micron-demo-ddr5-subsystem

This way they wouldn't have to do Ryzen 3K two times. Once for X470/B450 and another for X500s/B500s.

AMD is longer hampered at the 7nm FinFET plus node either. So, they can hop onto the 5nm FinFET at TSMC. Since, early on this year GlobalFoundries said they weren't going to do 5nm.
Ryzen 2800s => 7nm FinFET
Ryzen 3000s => 7nm FinFET+ or 5nm FinFET (7nm FinFET to 5nm FinFET all being the same node; standard cells are compatible. Full EUV with the most relaxed PDK do to less complexity.)

Why would they do that? They'll go to 3000 series for Ryzen 2, 4000 series for the refresh, and then 5000 series for Ryzen 3 although I have a hunch they'll call it Ryzen Gen 5 or something (which should bring DDR5, PCIe 5, and think there might have been another "5" - maybe the chipset). But this way its all 5s for when they make that move. We might see them add DDR5 controllers to the Zen 2 refresh (mostly for EPYC as when they move to 64 cores this would let them increase the bandwidth without increasing the memory channels; but this way there's options for cheaper DDR4 still, but DDR5 for those that need the extra bandwidth and can pay for it).

That will be interesting to see (if there's a 7nm EUV step before the move to 5nm or if they just get EUV up and running on 7nm but for production just implement it on the 7nm node; I personally think that it'll be the former and that we might see Zen 2 refresh be only for EPYC and Threadripper, but that will be when they make the move to 64 core; with them waiting to see how things shake out from there, meaning how much production EUV offers and if 5nm uses it entirely). I've speculated this before, but I think
 

Joseph Combs

Member
Jul 27, 2018
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Thanks to all who gave their input!!! I also learned a great deal by reading your comments since I am an enthusiast but not an engineer! Thanks!
 

cellarnoise

Senior member
Mar 22, 2017
774
420
136
I believe anything zen+ over 8 cores a die on 12 whatever from GF to be fake, but...

With all the uncertainty around 7 whatever size and several years out, I can imagine that AMD might have a GF backup plan with 12nm larger core plan. Might even be optimized for the 12... Could be a dual 6 core ccx or 5 ccx, but I doubt it. But with the cost and uncertainty around shrinks and GF wafer commitments and rumors around 48 core epics????
 

Shmee

Memory & Storage, Graphics Cards Mod Elite Member
Super Moderator
Sep 13, 2008
7,884
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Could very well be fake, most probably is. I usually take these rumors and leaks with an ocean of salt.