Arachnotronic
Lifer
- Mar 10, 2006
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They might want to save Ryzen 3000s for DDR5.If it's 7nm it's not Ryzen 2k. There would be a lot more different than just a die shrink.
-Viktoria said:Dunno about this one, Cinebench scores can be very easily edited in any text editor.
NB: I still think this is fake.
7nm insurance design.
You have your 7nm design, you go all out on this - 8 core CCX, 16 core dies, 64 core Epycs.
But ... in 2016 and 2017 AMD didn't know that TSMC would pull through on their 7nm promise in H2 2018. But they needed Epyc 2 by Q1 2019.
So you design a 12nm backup. You have power and die size issues here, you cannot go all out like with the 7nm design. So you go for a 6 core CCX, 12 core dies, 48 core Epyc 2. This 12nm was likely taped-out and probably had some silicon spun.
This fits with some rumours that it would be 48C initially.
But then GlobalFoundries tell you they won't be doing 7nm (initially this was probably a strong hint, or saying it will be late, or similar). Or TSMC say that Apple bought all the space. Result: your booked Zen 2 runs at TSMC cannot cover all of your product need for consumer space.
7nm consumer Zen 2 is put back, H2 2019 say. Not a disaster to wait that long really, but right now, Intel is hurting on their 10nm process, and don't you just want to stick the knife in?
And you have a 12C Zen or Zen 2 based 12nm die, and you also need to make stuff on GlobalFoundries because of wafer agreement. And you also want to have something to compete in some metric (i.e., multi-threaded performance) against Intel's 8C consumer chips coming in Q4.
So you leave a space in your line-up just in case you need a 2800X later in the year. You get a thousand wafers of your new design fabbed, you fuse off some of the Zen 2 features for next year's products. You package up the samples and send them out to OEMs and partners.
Given that timeline, I'd expect to see initial leaks happening right about now.
NB: I still think this is fake.
They might want to save Ryzen 3000s for DDR5.
Another speculative:
2870(X) => 16-core Zen2 w/ DDR4
2850(X) => 14-core Zen2 w/ DDR4
2820(X) => 12-core Zen2 w/ DDR4
2800(X) => 10-core Zen2 w/ DDR4
At that point Ryzen 3K might as well be based on Milan.
https://www.anandtech.com/show/12710/cadence-micron-demo-ddr5-subsystem
This way they wouldn't have to do Ryzen 3K two times. Once for X470/B450 and another for X500s/B500s.
AMD is longer hampered at the 7nm FinFET plus node either. So, they can hop onto the 5nm FinFET at TSMC. Since, early on this year GlobalFoundries said they weren't going to do 5nm.
Ryzen 2800s => 7nm FinFET
Ryzen 3000s => 7nm FinFET+ or 5nm FinFET (7nm FinFET to 5nm FinFET all being the same node; standard cells are compatible. Full EUV with the most relaxed PDK do to less complexity.)
They might want to save Ryzen 3000s for DDR5.
Another speculative:
2870(X) => 16-core Zen2 w/ DDR4
2850(X) => 14-core Zen2 w/ DDR4
2820(X) => 12-core Zen2 w/ DDR4
2800(X) => 10-core Zen2 w/ DDR4
At that point Ryzen 3K might as well be based on Milan.
https://www.anandtech.com/show/12710/cadence-micron-demo-ddr5-subsystem
This way they wouldn't have to do Ryzen 3K two times. Once for X470/B450 and another for X500s/B500s.
AMD is longer hampered at the 7nm FinFET plus node either. So, they can hop onto the 5nm FinFET at TSMC. Since, early on this year GlobalFoundries said they weren't going to do 5nm.
Ryzen 2800s => 7nm FinFET
Ryzen 3000s => 7nm FinFET+ or 5nm FinFET (7nm FinFET to 5nm FinFET all being the same node; standard cells are compatible. Full EUV with the most relaxed PDK do to less complexity.)
I particularly like this explanation from reddit, why not to put trust into such cinebench scores. Courtesy of -Viktoria