Seen how a single Milan-X 8 core chiplet with that quality is sold for at least $900 and are selling all of them, I doubt they would set two of them for a $1000 59503DX CPUPretty dissipated by AMD's 2022 CES keynote.. Would have bought 5950x3d for 1000$ in a heartbeat. (was planning to buy a few so i could bin them myself)
Do you expect 5800x3d to cost over 600$ ?Seen how a single Milan-X 8 core chiplet with that quality is sold for at least $900 and are selling all of them, I doubt they would set two of them for a $1000 59503DX CPU
I believe it will be close to $600 since many of those chiplets are lower binned chiplets that will not go into Milan-X.Do you expect 5800x3d to cost over 600$ ?
I can live with limited quality halo product just fine
Do you expect 5800x3d to cost over 600$ ?
I can live with limited quality halo product just fine
And before anyone says something, my overclocking and computer tweaking hobby is very cheap compared to my other hobbies. (HIFI and cars)
It would have been good PR for AMD in benchmark-charts on different forums aswell.
(i like to complete and benchmark)
Since you choose to quote me on exactly that and link my game gamebenches.A stock Intel 12900K with same MB/RAM configuration used as test bed by AMD, gets about 180 FPS on Far Cry 6(1920x1080), the 5800X3D gets a 10% boost on top of that

5800X3D it is: https://videocardz.com/newz/amd-con...-launches-this-spring-zen4-raphael-in-2h-2022
Other models MIA, I guess they are betting on Zen 4 instead?
This single Zen3D is just a formality.
Too little too late, better to save the money for AM5 and Zen 4 at the end of the year.
Not UltraCan you show me where a stock AL 12900k gets ~180 fps in Far Cry 6 @ 1080p Ultra ?


I'm sure its me thats stupid, but can you tell me the meaning of your post and the quote of me then ?
What have the statement to do with what you quoted ?A stock Intel 12900K with same MB/RAM configuration used as test bed by AMD, gets about 180 FPS on Far Cry 6(1920x1080), the 5800X3D gets a 10% boost on top of that
No, I could not open the link you posted, so I guessed you were asking to get some gaming performance(well the ones available from AMD) with available infoI'm sure its me thats stupid, but can you tell me the meaning of your post and the quote of me then ?
What have the statement to do with what you quoted ?
Nevermind then, guess it was just a misunderstanding 🙂No, I could not open the link you posted, so I guessed you were asking to get some gaming performance(well the ones available from AMD) with available info
Thanks, I am currently using a pc that has that page blockedNevermind then, guess it was just a misunderstanding 🙂
In anycase this is the url i was trying to link:
So, TODAY Zen3d was announced, and not even a definitive date set, just hinted at. So why again, do you say it was put on hold ? And per your previous post, a "non-launch" of a product not announced yet ? It was never announced before. Below is your original post:Yup, that is the hypothesis I had since Zen3d was put on hold on desktop and all of the H2 2021 production was diverted to Milan-X.
(I seem to recall I was harshly criticized by one of the moderators for saying desktop Zen3d was put on hold.)
OTOH, good thing they are primary targeting gaming, with 5800x3d. Hopefully, it will get some high binning parts, rather than worst, as was the case with 5800x.
It will be interesting to see 5800x3d beat 5950x in gaming, to prove that those extra cores were almost useless in gaming.
AFAIK, that is not how it works. The cpu is not thinned after the wafer is diced. The whole wafer is polished down so there is no binning before thinning. In fact, the stacking process is likely at wafer level also. They thin the cpu wafer and then make a “reconstituted” or “carrier wafer” that contains cache chips (diced) and filler silicon. The entire wafer is stacked, bonded, and then diced. I assume that this also why it is limited to wafers made at the same facility. This should work fine for binning since Milan-X should be able to absorb parts with defective cores. They will probably go down to 2 or maybe even 1 core active for special large cache per core versions like the current 72F3 which is 8 cores and 256 MB L3. That one is the full 8 CCDs with just one core active per chip. These can be a little more leaky since the core count is so low, but the rated TDP is also not that high, so there are some limits. They don’t have use for 8 core leaky die in Milan-x, but the lower core count die are mostly still usable for Milan or Milan-x parts of some kind. The 8 core die are mostly used in 32 or 64 core devices, where the power consumption would be limiting so they should have a lot of 8 core die that are not usable in Milan-x.Server CPUs typically take lower leakage (and thus lower max turbo) bins. If it gets rejected from Milan-X then it is usually because it is too leaky. Those too leaky CPUs shouldn't have a need for a reduced single core turbo though, only when lots of cores are loaded.
Maybe Milan-X bins are even tighter than Milan to try and get the most efficient dies to somewhat offset the increased power brought by the larger L3? Even if so, the CCD fabrication is separate from the V-cache so if they have CCDs that don't meat stricter Milan-X bins but still can be used for Milan, then why send them for 3d packaging in the first place? To this effect, there shouldn't be any Milan-X cast offs as the CCD will fail binning for Milan-X before being thinned and stacked. Maybe they aren't binning at all prior to stacking but that would seem very foolish and wasteful.
I think AMD's explanation makes the most sense. With the increased cost to produce, they are using the 5800x3d as a test case to see how the market reacts. This will have minimal disruption to their other lines and give AMD market feedback on 3d cache consumer products.
Maybe but they don't need such a part. 5800X3D will beat all of AL parts except maybe tie the performance of that new furnace intel is advertising on twitter. AMD will do great in both mobile and desktop, they will basically have top/near top performance in each segment, the only missing part that would be ultimate enthusiast chip is the 5900X3D. Come Q3 and Zen4, it will be a reprise of Zen3 vs CometLake due to massive IPC, Vcache and clock uplift Zen4 will bring.Would a Full Zen3+(6nm + DDR5) at 5.2 Ghz been enough to match Alder Lake in Gaming? Extrapolating the information we have about rembrandt it would have been very close in gaming, but I think that they don't have enough 6nm capacity
AFAIK, that is not how it works. The cpu is not thinned after the wafer is diced. The whole wafer is polished down so there is no binning before thinning. In fact, the stacking process is likely at wafer level also. They thin the cpu wafer and then make a “reconstituted” or “carrier wafer” that contains cache chips (diced) and filler silicon. The entire wafer is stacked, bonded, and then diced. I assume that this also why it is limited to wafers made at the same facility.
This should work fine for binning since Milan-X should be able to absorb parts with defective cores. They will probably go down to 2 or maybe even 1 core active for special large cache per core versions like the current 72F3 which is 8 cores and 256 MB L3. That one is the full 8 CCDs with just one core active per chip. These can be a little more leaky since the core count is so low, but the rated TDP is also not that high, so there are some limits. They don’t have use for 8 core leaky die in Milan-x, but the lower core count die are mostly still usable for Milan or Milan-x parts of some kind. The 8 core die are mostly used in 32 or 64 core devices, where the power consumption would be limiting so they should have a lot of 8 core die that are not usable in Milan-x.
Only selling the 8 core makes sense in a lot of ways. The number of people who have a 12 or 16 core and who would be willing to upgrade to an X3D version is very small. They would probably rather have those people spend the big money later in the year for a completely new Zen 4 system. Going to dual CCD devices cuts volume in half for something that is likely already low volume. It also might cannibalize other sales if they released such a device. I would definitely consider such a 16 core for a compile machine instead of Epyc or Threadripper / Threadripper pro if it was available. If the device had come out a few months ago, then a more full product range might have made sense. A lot of things have been delayed due to covid shutdowns and such. Even regular Milan availability seemed to be a problem for a while. We are not going to get new threadrippers until the Milan backlog can be resolved.
For most people, it will be wait for Zen 4 unless you need a new system right now or have an older chip that can be upgraded. It is likely not going to be worth it if you already have a 12 or 16 core. I would still consider a 5800X3D because I have dealt with board revision 1.0 before and I have an ancient desktop system at the moment with no upgrade path. Zen 4 will be new everything and expensive. The 5800X3D will be probably be the last and highest performance AM4, except some heavily threaded applications where 12 or 16 cores may still win. Waiting for Zen 4 and DDR5 might be a longer wait than expected due to the inevitable shortages.
^ Not ragging on your hobby since I do the same, but knowing Zen4 is coming up in less than a year, switching 5950X for a slightly boosted 5950* sounds like a chore. A 5800X or 5900X, sure, if there are multithread use cases that are noticeable.
The fact that the single core frequency is lower mean that diffusion of the heat is too slow
A pity but French guy was right, AMD is at the mercy of the foundries.
Would a Full Zen3+(6nm + DDR5) at 5.2 Ghz been enough to match Alder Lake in Gaming? Extrapolating the information we have about rembrandt it would have been very close in gaming, but I think that they don't have enough 6nm capacity
This looks to be turning into a complete debacle for AMD.
When using thinned dies in the past, they were always diced first as getting a flat thinning across the entire wafer is difficult, that's what the foundry told us anyway but it probably comes down to the tools used (there are different methods of thinning) and how thin you want the substrate.
I would rather guess for AMD there's a plan B of 5950X3D/5900X3D if Zen4 was redacted by some other factors and delayed, such as DDR5 price. Everything could be variable.If production capacity is limited then you cut it in half by releasing anything that needs two CCDs. Maybe we'll get those later or not at all depending on production capacity, but if you're going to sell what's branded as the best gaming CPU then it's probably better to have more of them for sale.
Unless you were buying into the nonsense of Zen3D being a generational replacement because Zen 4 was delayed then this shouldn't seem surprising.