Boeing is another thing entirely. They were a great engineering led firm destroyed when the incompetent beancounter management from McDonnell Douglas took over.
AMD can allow Zen3d and Zen4/Raphael to co-exist to fill different niches in the market. There's no reason for them to delay Zen4 that much
Do we all assume that added cache is ready for prime time with Zen4? It would be rather confusing for consumers if Zen3(D) outperformed Zen4 in certain workloads if it isn't.
Zen 4? Did you lose your thread? You asked what productized means in a reply to this post:So that mean rendered producible, wich they can not do with Zen 4 since they have no definitive silicon.
The translation for you: V-Cache will be turned into a product using 7nm Zen 3-based Ryzen processors. No Zen 4 there.
- This technology will be productized with 7nm Zen 3-based Ryzen processors
The answer was already given, so no need to guess. Pretty much what you and most people surmised.I don't know the full cost of adding 1 stack of cache but I have an idea due to personal experience. Without full knowledge of all the costs and the yield AMD expects from stacking as well as taking hints from what AMD has revealed, I can only say that I don't have much confidence in AMD going 4+ hi stacks on Ryen 3d due to both costs of doing so and diminishing returns in performance. I do know that AMD knows these costs and if they think it is worth it from a cost and opportunity cost perspective, then we'll see those SKUs and I'll be happy to be wrong.
In a call with AMD, we have confirmed the following:
- The V-Cache is a single 64 MB die, and is relatively denser than the normal L3 because it uses SRAM-optimized libraries of TSMC's 7nm process, AMD knows that TSMC can do multiple stacked dies, however AMD is only talking about a 1-High stack at this time which it will bring to market.
Surplus N6/N7 is a unicorn 😀 .There's no reason for them to delay Zen4 that much, but there's plenty of reason for AMD to extend the life of AM4, especially if TSMC has a surplus of N6 wafers available at a lower price/wafer than what AMD was paying for N7 back in 2019.
Marketing demands new products. You can't go two full years without a product refresh. If Zen 3D launches at CES it could be 10-12 months before Zen 4 consumer does.
Unless they don't have the chips available because Zen 4 got delayed because of rona-related problems and/or Genoa is taking them all.
Do we all assume that added cache is ready for prime time with Zen4? It would be rather confusing for consumers if Zen3(D) outperformed Zen4 in certain workloads if it isn't.
Surplus N6/N7 is a unicorn 😀 .
On redundancy and yield — through-silicon-via (TSV) interconnects may also apply redundancy to improve yield:
Why would anyone buy a Zen 3D mid-cycle when Zen 4 is that much closer? Particularly if details start to emerge suggesting that the next CPUs will use a new platform and that Zen 3D is a dead end platform wise.
I think it is completely safe to expect that all future AMD's top of the line desktop/workstation CPUs will continue to ship with stacked L3. I have zero doubts that this 3D stacking will spread to other companies as well and AMDs GPU department too. It's like free lunch that also enables one to rise ASP and compete in market. We had clock wars, core count wars and now cache wars will properly begin.
The future is bright overall, imagine Ampere, but instead of ridiculous 120W guzzling GDDR6X, it has 256MB of L3 stacked? I think this will give awesome one time performance boost to everyone from Nvidia to custom ARM crowd.
My gut feeling about Z3D vs Alder Lake situation - for typical desktop and gaming ADL will be very handicapped by DDR5. Anandtech and otherenthusiast servingsites will be happy to test it with DDR5 4800CL40 JEDEC, that will perform ~DDR4 2400CL20 levels and ~15-16ns of latency.
That is why we have Cinebench leak only - 30% IPC gain there, but probably disastrous performance everywhere else. Imagine Anandtech 11700K prerelease testing, but square it due to low speeds of new memory subsystem and immature IMC code.
So at stock speeds AMD will easily win with 96MB of L3, for proper enthusiasts a lot of things depend on prices and speeds of proper DDR5 memory ( and maybe DDR4 mobos?).
Do we all assume that added cache is ready for prime time with Zen4? It would be rather confusing for consumers if Zen3(D) outperformed Zen4 in certain workloads if it isn't.
I think Zen 4 will be release right out of the gate with some SKUs that will have 3D stacking.
Surplus N6/N7 is a unicorn 😀 .
AMD's customers cannot get enough chips. Sony and MS already publicly said many time they are supply constrained all the way into end of 2022.
And official TSMC Foundry update said they will not invest anymore in N7/N6 capacity. The focus is N5 ramp.
Why delay Zen 4 at all though? Or rather why would you not expect it until late 2022 or even 2023? That makes for an incredibly odd schedule on AMD's part.
I doubt Zen 3D is meant to be a top to bottom replacement for the whole line. I think AMD is just using it to help learn how to work with the technology that TSMC has so it can be more widely incorporated into future products.
Maybe it gets a limited release as a top-end Ryzen product, but it's far more valuable in Threadripper or Epyc.
My guess is that it will be even more optimized for stacking than Zen 3, perhaps with larger area on the die being low power, eligible for stacking, so that (together with slight reduction of SRAM cell in N5) the unit of stacking in Zen 4 goes up to 128MB.
Two possibilities are stacked L2 and changing the L3 to be inclusive, although if one happens the other seems less likely by virtue of inclusive L3 making the most sense when L3 is relatively large vs L2.
The problem for AMD is Alder Lake being a Q4 2021 product. They need to launch Zen 3D in Q1 2022 in order to show activity. But it seems the client Zen 4 will still be far away.It's possible, but I don't think it will, at least not on mainstream desktops. Assuming Zen4 convincingly beats Alder Lake (a fair assumption, given that AMD apparently doesn't feel the need to release 24c Zen4), I see AMD holding back Zen4-3D until around the Meteor Lake timeframe. Among other things, they will be able to more aggressively bin those premium, cache-stacked stacked parts later on when the node is more mature.
Two possibilities are stacked L2 and changing the L3 to be inclusive, although if one happens the other seems less likely by virtue of inclusive L3 making the most sense when L3 is relatively large vs L2.
Thus pushing the client Zen 4 (end maybe even server) back to Q4 or so.
So Zen 4 has to be ready not for the OG Golden Coves but their refreshes or even newer gen.
www.techspot.com


I was involved in that discussion about 2 weeks ago or so. I kind of gave up on it. There are a bunch of technological arguments, but just because something is possible doesn’t mean that it will be a product. There doesn’t seem to be any room for the 4 high cache variant between top end Ryzen and Threadripper. They could make a large cache per core version of Threadripper without even using stacking. I have seen some gaming benchmarks with a Epyc 72F3 (8 cores, 32 MB per core, 256 MB total) vs. Intel Core i9-11900K; I don’t know how reliable they were though. The Epyc managed to win with a much lower clock, but not by a huge amount. The cpu can only do so much before you run into gpu bottlenecks. I am curious as to what Zen 3 Threadrippers will look like. AMD could make a version with very high cache per core, but the Epyc versions with huge cache per core are not cheap; the 72F3 is something like $2500, if you can get it. The supply of Milan processors seems to be very constrained right now.Geez, got way behind on this thread somehow. The signal to noise level is pretty low. This thread is trying to compete with on the level of a P&N thread. Guess I’ll just wait till some CPUs to be released rather than read all this endless bickering 🙄