- Mar 13, 2006
- 10,140
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Take aways...
This will be the final report.
Transistor scaling ends after 2021 due to economics.
2019 the move from finfet to gaa begins. Next comes 3D stacking.
2024 another thermal wall is hit. Microfluidic channels used to increase effective surface area.
http://www.semiconductors.org/main/2015_international_technology_roadmap_for_semiconductors_itrs/
This will be the final report.
Transistor scaling ends after 2021 due to economics.
2019 the move from finfet to gaa begins. Next comes 3D stacking.
2024 another thermal wall is hit. Microfluidic channels used to increase effective surface area.
http://www.semiconductors.org/main/2015_international_technology_roadmap_for_semiconductors_itrs/
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