Discussion Zen 5 Speculation (EPYC Turin and Strix Point/Granite Ridge - Ryzen 9000)

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Saylick

Diamond Member
Sep 10, 2012
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Got this from Olrak on Xitter. Looks like the gaming comparison was made using 6000 MT/s DDR5 for both Zen 5 and the 14900KS. The Intel mobo was set to "Intel Defaults", but I'm not entirely sure what that means these days.

1717386868404.png
 

Joe NYC

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Jun 26, 2021
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No it's the actual CDNA4.
Different stuff to support way different speeds and feeds.

That one moves the paradigm into a different direction.
Used to be called MI500.

Mi400 should coincide with HBM 4 in 2026.

Since HBM4 will be SoIC stack, I wonder if my prediction will turn true, and at that time, AMD will have HBM stacks on top of base AID dies...
 
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Geddagod

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Dec 28, 2021
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Joe NYC

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Jun 26, 2021
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Weird that no pricing info was released for Ryzen 9000 and no release date.

I think the pricing will be roughly the same as Zen 4, and given the IPC uplift is underwhelming, AMD will have to release V-Cache models ASAP, hopefully before Christmas, at the time of Arrow Lake launch.
 
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Jayzen

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May 5, 2024
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So basically all computing devices: Flop
Back to the the slide rule or abacus I suppose.
ronswanson-parksandrec.gif
 

Joe NYC

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Jun 26, 2021
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No it's the actual CDNA4.
Different stuff to support way different speeds and feeds.

That one moves the paradigm into a different direction.
Used to be called MI500.

There were some rumors that the next version (presumably CDNA4) would reshuffle the die sizes, moving to fewer and bigger dies.

If that's part of the plan, would that be part of the Mi350 (using the current naming) or one after that, Mi400?
 

branch_suggestion

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Aug 4, 2023
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So the sitrep is thus:
Granite Ridge: 20% IPC is the goal for a major tock, it failed. V-Cache will save the day in gaming so we are more or less status quo assuming LNC is a similar IPC bump with a small clock regression.
Turin: Still dominant, looks better than desktop does for sure.
Strix: Good, should be enough to justify the big jump in design wins, also looks a bit smaller than expected.
Z5 in general is the smallest bump since pre-Zen, but it does enough to retain its place in the market.

For the other stuff, Versal is great, MI roadmap is excellent and the overall ecosystem is looking very simple and workable now, which is great for everyone.
We will wait for all the final details and deep dives to get the full picture, overall it looks steady and solid, but unfortunately expectations were to kill the comp.
AMD themselves though never lied, this isn't an RDNA3 situation.
And to MLID, well you get to live another day, at least until LNC ends up being 15-20% IPC.
There were some rumors that the next version (presumably CDNA4) would reshuffle the die sizes, moving to fewer and bigger dies.

If that's part of the plan, would that be part of the Mi350 (using the current naming) or one after that, Mi400?
Yeah packaging yield is a concern so less dies balances the net yield. Wafers are plentiful relative to adv packaging.
 

Saylick

Diamond Member
Sep 10, 2012
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View attachment 100290

This slide was spot on, seems Zen 6 with 10% IPC would be what I would bet on.
MLID the winning leaker.

AMD took almost two years for a paltry 16% while Apple and ARM iterating on almost yearly cadence.
Based on that trend, whatever comes after Zen 6 is gonna have like 5% IPC increase and then after that 0% IPC uplift.

/s