Any reason why you expect the GF 7nm LP would have been better than TSMC CLN7FF?
POWER10. If I recall correctly - and maybe I don't - GF was planning on letting AMD fab on the same process as POWER10, which would have been an HP node. POWER chips tend to need/want high clockspeeds for the highest-end chips, which would have meant speeds at or near 5 GHZ. So the process limits would have to allow speeds that high. Everything else would have been design-related. AMD could have gotten there if they had wanted to.
GlobalFoundries hasn't provided anything but failures since the 32nm SHP SOI got mature. What would have made them to succeed / meet the given promises this time around?
Mostly true, but somehow they managed to deliver on HP nodes for POWER. Until now.
Interestingly enough, I've seen some recent announcements that POWER10 is now slated for 2020, on a 10nm process. Whose 10nm process is that? Originally it was supposed to be a 7nm process at GF. Obviously that isn't happening.
Personally I expect the TSMC process to be a great thing for Zen 2.
I'm not saying TSMC's 7nm process will be bad at all. I'm happy because it keeps Matisse on-schedule. GF was a potential delay threat, had GF continued development of their 7nm node and had AMD kept Matisse on that release schedule. The power characteristics also should be pretty good, and I think everyone will be impressed with the consistency of yields.
Not necessarily due to the (speculated) characteristics, but because the process provider isn't called GlobalFoundries.
Zing! I would like to see you in a boxing match with Hector Ruiz in an event similar to Uwe Boll vs Lowtax Kyanka. And no, I'm not just being a jerk - you'd probably curbstomp the old man. He would deserve it, too.
Of course I do not think he's really associated with GF anymore (except maybe as a shareholder).
Obviously it would be possible to improve the situation by using empty margins on the design, but I highly doubt that neither AMD or Intel is willing to spend expensive wafer space for the purpose.
It may be time for Intel and AMD to start using tiny heat pumps/TECs just to spread out heat at little. Or maybe IHSes that double as vapor chambers, or CNT IHSes, or . . . hell I don't know.