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Yet another Core i7 cooler question

T

Tullphan

Diamond Member
From what i've read, the Core i7 has about 30% more real estate than its predecessor.
When shopping for a cooler, I've noticed that the coolers I was looking at stated S775/S1366. I would think that if the S1366 had a base large enough to cover the newer style CPU, it would be too large for a S775 motherboard.
I've heard alot of talk about "adapter plates for S775 coolers so one can use them on the S1366. I own several S775 coolers, but am leery of using an adapter plate on my future i7 purchase as i'm planning on overclocking it slightly.
Do I have good reason to be leery using one of these adapter plates? The cooler i'm currently using (Coolermaster N620) is keeping my QX6700 fairly cool, but don't know how it'd do on an overclocked i7.
Ideas?
Suggestions?
Thanks.
 
Originally posted by: Tullphan
From what i've read, the Core i7 has about 30% more real estate than its predecessor.

Thanks.
Click to expand...



still smaller then a dual die yorkfield.
 
I'm concerned about keeping the CPU cool.
Quoting from this review of the GA-EX58-UD4P:

There is still one minor drawback for the X58 platform which effects enthusiasts: the difference in CPU cooler mounting dimensions. Many overclockers and enthusiasts have grown to cherish their favorite cooler, and trust them to cool the hottest setup. The problem now is that many manufacturers are offering free adapter kits, or include an adapter with their current model coolers, which leads to bigger problems.
CPU coolers made for the LGA775 platform were designed for use with a Core 2 (Duo or Quad) or Pentium 4 and D processor with an integrated heat-spreader measuring 28.5 x 28.5mm (812.25mm total), but the LGA1366 socket requires a much larger 32 x 35mm (1120mm total) footprint to accommodate the extra 591 'pins'. If you use an LGA775 cooler on a LGA1366 socket, your missing out on 38% (307.75mm) of the contact surface.

Now, when I see a CPU cooler for sale that states it's for S775/S1366, am I going to have to contact the vendor to see if has the larger footprint?
 
ugh dont make me point out all the things wrong with his statement.

1. Kentfield is hotter then a i7. Flat out straight simple.
2. The only area u need the sink covering is the underlying area where the DIE's are located. Having a sink on the entire IHS is not really needed.
3. Kentsfield which offered 2 60nm Die's had a larger die area then the i7 which is a native quadcore die @ 45nm.

So Olin is yabbing gibberish. .
 
So if I can get an adapter plate for the N620 that's currently keeping my overclocked QX6700 at acceptable temperatures (3.2Ghz @ 1.29V...mid-70's w/OCCT...room ambient 33C), it'd be sufficient?
 
yes

Assuming u hold heat load constant. Thats quite low voltage you running there btw.

The i7 will generate more heat @ that voltage when your clocked higher.
 
So I guess I should get a better HSF?
I thought considering what I was cooling, those were pretty good temps. It also cooled a Q6700 I had @ 3.2 & 1.3V...52c stressed...but that was in the fall of the year when it was a tad cooler here in the office.
From what i've read, 3.7-3.8 is about what one can expect out of an i7 920 w/aftermarket cooling for 24/7 use...is this true?
 
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