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WTF, my Retail RAMsinks fell off.

Triggerhappy007

Golden Member
The RAMsinks on my Retail PNY GF3 Ti200 card fell off. Looks like the tape doesn't stick very well to the memory. Any solutions to this that's cheap? I don't really want to buy AS glue.
 
Bah. If ya ask me, ya dont need them. I have a GeForce2 Pro card running at Super-Ultra speeds (233 and 450, core and memory) and I have no ramsinks and the memory chips are barely warm to the touch even after intense benchmarking.

Of course, your results may differ, so if you think you need them, of course dont hesitate to re-attach them. I'd recommend some Arctic Adhesive; you dont want to mess around with super glue.
 
I don't think it's worth RMAing a whole video card for some lousy adhesive on the RAM. I usually rip heatsinks off anything and apply ASII and epoxy to the things. Having them fall off just makes it easier for me.
 
When I first got my PNY Geforce 3 TI200 I had the same problem they were not attached well I just squeezed them on there. I agree, dont RMA the thing just get some thermal epoxy and put um back on. While your at it take off the HSF because it has a thermal pad under it which sucks put some Arctic silver on it or somthing. Until you fix it you will be fine. Also if you want you can read my review of your card. OCModShop Review
 
wouldn't it just be possible to mix a fair amount of arctic silver with the epoxy?
I might just make a few mixtures...I'll let y'all know if it is do-able...
 
I've always had good luck with small sinks/small chips all the way up to 486 CPUs by this method:

Take heatsink, smear heatsink compound over surface evenly. Leave a small area of each corner bare.
Do the same with the chip you intend to put the sink on.
Take a pin (so you don't end up shooting superglue all over) drip superglue on it and use this to apply glue the the bare corners of the chip.
Put the heatsink in place, don't slide it around, just straight on and hold pressure till glue sets. With superglue, a few seconds usually.

Need very little glue, 1/4 of a drop per chip should be plenty.

Voila, heatsink stuck in place, heatsink compound without epoxy mixed in unknown ratio over the core, just the corners with less than ideal transfer. Which with many chip packages isn't an active portion anyway...think CPU, outer 1/2" of the ceramic wasn't over the 'chip' itself back in the pre flip chip days. With ram chips, not nearly so much extra package, but not nearly so much heat and the edges are the coolest to start with.

Good luck

--Mc
 
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