Searching on Google appears to reveal that the FX60 has a die size of 199sq.mm. and the R580 has a die size of 315sq.mm.  So, in terms of size of the die, the clear winner (or loser  

  ) is the R580.  This translates to higher manufacturing cost for the R580 - fewer die per wafers, lower yield due to larger die size.
"Advanced", however, is a non-scientific term.  It requires a judgement on what constitutes "advanced" and then applying this to the designs and deciding.  A couple of quantitative ideas for "advanced" could be:
1. comparing the size of the design team and the length of the design time
2. comparing the quantity and irregularity of the non-memory structures
3. comparing the complexity of the logic - how regular is it.
4. comparing the length of RTL code
Without access to the numbers for either design, but based on my knowledge of the industry, I would say that the FX60 wins (or loses if you have to fund the development) hands-down on all 4 of these.  But really these are measures of complexity - not "advancedness".  I'm not sure what constitutes "advanced".  But based on my biased opinion (I design CPUs), CPUs are more complex, and are more advanced.