As we have seen, in the last 3 years there has been relative stagnation in the Video Card space.
Part of this is the slow pace of semiconductor process advance.
The other part is that over time Video Cards have gone to higher and higher power points to achieve higher than otherwise advances in compute speed.
In the last 3 years the highest Nvidia and AMD have been willing to go is 250w soft limit 300w hard limit on their reference single gpu cards.
As we have seen this is mostly due to their 2-slot reference blower cooling solution's lack of ability to scale higher than 300w TDP @ 80c.
Any likely increase in TDP of reference cards over 300w will have to be met with reference solutions that are deemed good enough and cheap enough to accommodate the increased heat dissipation requirement.
One obvious way for them to increase TDP is to implement 2-slot open air systems, which would restrict their use in Crossfire/SLI implementations as well as their use in small form factor cases and cases with inferior air-flow.
The other obvious way for them to increase TDP is to implement 3-slot blower systems with either single or double opening.
(double opening like as pictured here:
http://www.dvhardware.net/news/2012/his_radeon_hd_7950_iceq.jpg
http://www.hisdigital.com/UserFiles/product/H795QT3G2M_01_1600.jpg )
A triple slot solution would likely double or more than double exhaust area at the back of the card, the most limiting restriction on blower performance.
Part of this is the slow pace of semiconductor process advance.
The other part is that over time Video Cards have gone to higher and higher power points to achieve higher than otherwise advances in compute speed.
In the last 3 years the highest Nvidia and AMD have been willing to go is 250w soft limit 300w hard limit on their reference single gpu cards.
As we have seen this is mostly due to their 2-slot reference blower cooling solution's lack of ability to scale higher than 300w TDP @ 80c.
Any likely increase in TDP of reference cards over 300w will have to be met with reference solutions that are deemed good enough and cheap enough to accommodate the increased heat dissipation requirement.
One obvious way for them to increase TDP is to implement 2-slot open air systems, which would restrict their use in Crossfire/SLI implementations as well as their use in small form factor cases and cases with inferior air-flow.
The other obvious way for them to increase TDP is to implement 3-slot blower systems with either single or double opening.
(double opening like as pictured here:
http://www.dvhardware.net/news/2012/his_radeon_hd_7950_iceq.jpg
http://www.hisdigital.com/UserFiles/product/H795QT3G2M_01_1600.jpg )
A triple slot solution would likely double or more than double exhaust area at the back of the card, the most limiting restriction on blower performance.