Whats the "right" amount of thermal paste?

[Fhistleb]

I usually just use stock paste, but this time i'm wanting to be more "dangerous" so to speak

I'm honestly not too sure what the right amount is, any tips or pointers?

 

[gsaldivar]

I apply a drop or two, then use a business card to spread it evenly over the surface of the core to create a thin even layer. Then I add 1 or 2 more drops and mate the HSF to the CPU.

Good luck!

 

[Blain]

Watch This

 

[corkyg]

As thin and smooth as you can make it. The purpose is to uniformly fill in the micro granularity of the two metal surfaces so as to maximize surface contact between the CPU and the cooler face.

 

[mfenn]

Watch This

:thumbsup:

This is the right way to do it. Trying to spread the compound out yourself is just asking for it to get all over your socket when you attach the heatsink. Physics, people! Make it work for you, not against you!

 

[Fhistleb]

Arctic Silver 5 is the industry standard when it comes to using this stuff right?

 

[mfenn]

Arctic Silver 5 is the industry standard when it comes to using this stuff right?

Pretty much.

 

[lxskllr]

I use between 5 and 9 TINY drops, and just clamp the heatsink down. It's worked well enough so far.

 

[Bateluer]

Grain of rice sized drop in the middle of the CPU, affix heat sink.

 

[fffblackmage]

Be sure not to over apply the thermal paste. I just re-seated the heatsink on my 550BE and temps went down about 10C just because I originally applied too much AS5.

 

[fluffmonster]

Grain of rice sized drop in the middle of the CPU, affix heat sink.

Drop method not recommended if your heatsink is HDT (exposed heat pipes directly contacting the cpu). The channels between the heatpipes and the aluminum holding block will interrupt TIM flow. Benchmark Reviews has a guide on thermal paste application with a demonstration.

 

[Mycroft]

I still use the business card trick after adding a few drops of Arctic Silver. No issues, just be wary like others have said of using too much...

 

[muskie32]

I just got a H70 (that had stock past on it) will i see a difference in using Arctic Silver 5 Alumina (that i also have) instead?

 

[Throckmorton]

.The blob method is a great way to either get incomplete coverage or have it spill off the sides, which is bad when you're using a conductive paste like AS5. It's physically impossible to get perfect coverage without spillover with this method! That's just common sense.

I take a ziploc bag, put it over my finger, squirt a little paste onto it, and rub it onto the heatspreader/die. Then I do the same thing with the heatsink. The viscosity of the paste itself determines how thick the layer is and applying to both surfaces ensures you get a good mating without any gaps. The excess stays on the bag. This method has worked for me since Socket A Athlon days (when application was a lot more crucial)

 

[Paperdoc]

If you are using the Arctic Silver products, see their website here:

http://www.arcticsilver.com/as5.htm

and use the links to find the right procedure, which depends both on the type of paste and on the type of CPU and heatsink.

 

[bryanl]

Arctic Silver is far too minor a company to set any industry standards, and electronics manufacturers are far more likely to use thermal chemicals from Thermalloy, Dow Chemical, Loctite, or Novagard. They also prefer dielectric pastes, which Arctic Silver is not, and some manufacturers have expressed frustration at the company's technical capabilities ("all sales, no science" is what I once heard).

The correct amount of compound is just enough to completely fill any gaps between the mating surfaces, and that can't be determined accurately without trying increasing quantities until no voids are seen when the surfaces are separated. Fortunately in practice the thickness isn't nearly as critical as some anxiety ridden souls believe, and a layer approximately 0.5-1.0mm will work fine. Press down and move the heatsink in a circular motion to squeeze out excess. But the clamping pressure of the heatsink will normally squeeze out the excess.

 

[muskie32]

But when it squeezes out the excess where does the excess go? the cpu/mobo? Or do you just try to "catch" it with like a paper towel?

 

[mfenn]

This:

The correct amount of compound is just enough to completely fill any gaps between the mating surfaces, and that can't be determined accurately without trying increasing quantities until no voids are seen when the surfaces are separated. Fortunately in practice the thickness isn't nearly as critical as some anxiety ridden souls believe, and a layer approximately 0.5-1.0mm will work fine. Press down and move the heatsink in a circular motion to squeeze out excess. But the clamping pressure of the heatsink will normally squeeze out the excess.

Not this:

I take a ziploc bag, put it over my finger, squirt a little paste onto it, and rub it onto the heatspreader/die. Then I do the same thing with the heatsink. The viscosity of the paste itself determines how thick the layer is and applying to both surfaces ensures you get a good mating without any gaps. The excess stays on the bag. This method has worked for me since Socket A Athlon days (when application was a lot more crucial)

If putting a bit of paste in the middle of the CPU causes it to spill over the edges, you're using too damn much!