Squirrel, if you want a very fine point on it, search the Cases & Cooling Forum in the archives for,"The MosFet Sink Mystery."
These small chips can generate considerable heat, particularly when one OCs. They can function very well at elevated heat levels, some FETs are speced to 125C. When things go wrong(very rare) the heat can get so high the solder melts. I've only seen pics.
The problem with cross flow heat sinks on the CPU as well as water cooling is mainboard air circulation takes a back seat. Sometimes the difference between a Ninja and SI-120 is that these chips*might* gain 20C in heat by using the Ninja. Is this bad...NO. As long as they stay under about 65C. Is having these chips cooler better...Yes, because board heat will move to the other electrolytics on the board through the traces to the capacitors. The caps are those tall cylinders that are next to the FETs and they service the FETs. Most caps are speced at 85C but the better ones are speced at 105C. So is there advantage to keeping the caps way below spec temperature, you betcha, because service life WILL be extended.
Thankfully, when caps fail, they generally fail in an open state. Like a circuit breaker. But when they fail in a closed state, all hell can break loose. That's when solder melts.
The area you are refering to is in a crowded space, between the CPU and i/o plate. This is a dead spot for air circulation and that is why your 64Pro has it's lower fins on the exhaust side curved down.
Your call what you do but I would go with what the HS manufacturer designed.
If you want to keep your current fan set-up, you could suspend a 60x10mm fan over this area, blowing down.
...Galvanized