According to Benchlife, a new Intel roadmap has seemingly confirmed that Intel is preparing the latest Kaby Lake-G processors. These processors will feature advanced technologies that do away with the older, conventional design scheme seen on Intel consumer chips. The new processors will feature core tech utilizing 14nm process and will have a dedicated PCI Express link to a separate discrete GPU along with faster HBM2 memory.
Intel recently confirmed at their Technology and Manufacturing Day that they’ll be moving towards a more robust and heterogeneous architecture. The new architectural layout will allow Intel to mix and match various CPU components and dies based on different process nodes and interlinking them on a single chip.
This would allow Intel to do away with the cost and efficiency of a single monolithic design and utilize smarter and more efficient designs for their future processors. The new processors will utilize an embedded, multi-die interconnect bridge allowing for high density and high bandwidth, die-to-die interconnects.
The main difference between a multi-chip package and a multi-die integration technique is that the former has poor density of die connections and interconnects while the later is not only denser but brings significant advantages at a lower cost. Intel could have gone with a silicon interposer layout but that costs more due to the massive number of TSV’s that need to be embedded underneath the main dies.Source
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