No, from what I've read - TSMC's 16nm will be no where near Intel's 14nm in terms of density and electrostatics. Of course, TSMC will do just fine - their real competition is Samsung and GFL, who are pretty much following the same path but still up river compared to TSMC.Update from Oct 30, 2013:
http://semiaccurate.com/2013/10/30/tsmc-shows-production-20nm-16nm-dev-wafers/
So by how much does TSMC's 16 nm trail Intel's 14 nm? About 1 year or so?
Intel did not state if they meant "risk" production or not though when they communicated the Q1 2014 timeframe. But since they are still having yield problems (they have said they "think" the problems have been solved), or have just solved them, I guess their 14 nm production should be quite "risky" too in Q1 2014 which is just a few months from now.
Risk production is a term that is essentially inapplicable to Intel. Also, I believe that they specifically stated that Broadwell would be what is going into production in Q1, which is absolutely a product that would be ramped during volume production, and no earlier.Intel did not state if they meant "risk" production or not though when they communicated the Q1 2014 timeframe. But since they are still having yield problems (they have said they "think" the problems have been solved), or have just solved them, I guess their 14 nm production should be quite "risky" too in Q1 2014 which is just a few months from now.
Can we read it too?
I'm not sure what sources he's read, but it's essentially common knowledge. TSMC and the other foundries can't keep up with Intel's metal pitches. GloFo and TSMC will be using their 20nm BEOL on their 14nm and 16nm processes, respectively (likely to keep costs down).
Risk production is a term that is essentially inapplicable to Intel. Also, I believe that they specifically stated that Broadwell would be what is going into production in Q1, which is absolutely a product that would be ramped during volume production, and no earlier.
They're not going to be running those things 24/7. The raw materials cost and electrical costs would be huge, for no purpose. The only thing that Intel would be using those fabs for during that phase, other than fine tuning the process, would be producing engineering samples and the like.Hmm, that brings up and interesting point. Pure fabs can sell some of their wafers during ramp up as risk production. And IDM like Intel has to 'eat' all those wafers (can they be written off?).
Intel did not state if they meant "risk" production or not though when they communicated the Q1 2014 timeframe. But since they are still having yield problems (they have said they "think" the problems have been solved), or have just solved them, I guess their 14 nm production should be quite "risky" too in Q1 2014 which is just a few months from now.
Just to clarify, I was not comparing 16 nm vs 14 nm process technology. Instead I was comparing the time difference between when the production using those two process technologies are expected to begin according to what has been communicated.
And the article says that TSMC will begin (risk) production of 16 nm in late 2014. Intel has previously said it will begin production of 14 nm in Q1 2014. So that's less than a 1 year difference, and it could be as little as around 6 months depending on if it's the beginning or end of the quarters they are talking about.
Do you really think we are going to see widespread 16nm products fabbed out of TSMC within 18 months of when Intel's 14nm products are widely available?
It appears you do, which just shows how much difficulty you have in separating what you wish for and what surely you must know(if you have been paying attention for the last decade) will be the case.
I agree. I'd imagine reduced time to market was a significant deciding factor in "choosing" to go with the 20nm BEOL.Why is it so unfathomable that TSMC's 16nm could take less time to come out than a full node transition usually does, seeing as how it's not a full node transition? And not comparable to Intel's 14nm...
Hmm, that brings up and interesting point. Pure fabs can sell some of their wafers during ramp up as risk production. And IDM like Intel has to 'eat' all those wafers (can they be written off?).
Why is it so unfathomable that TSMC's 16nm could take less time to come out than a full node transition usually does, seeing as how it's not a full node transition? And not comparable to Intel's 14nm...
18 months after Intel releases Broadwell is a big stretch, though.Because FinFet's are very, very difficult to get right. You're talking about atomic level manufacturing in three dimensions.
Because FinFet's are very, very difficult to get right. You're talking about atomic level manufacturing in three dimensions.
“We will begin volume production of 20nms in the first quarter 2014. That's 90 days from now. 16nm will follow 20nm in one year. We view both 20nm and 16nm as virtually one node,” said Morris Chang, chief executive officer and chairman of TSMC, during a conference call with financial analysts.
http://www.xbitlabs.com/news/other/..._Regarding_16nm_FinFET_and_20nm_Progress.html"On 16 FinFET, technological development is progressing well. Risk production is on schedule by the end of this year."
Why is it so unfathomable that TSMC's 16nm could take less time to come out than a full node transition usually does, seeing as how it's not a full node transition? And not comparable to Intel's 14nm...
If it was a full node transition, I suspect it would be 24 to 30 months later.
It seems to me that the foundries are struggling to introduce new processes that ramp properly, within the same time frames as Intel has been doing.
TSMC might show off a product at some point to claim they have their new process out, but just as it took forever for 28nm to be widely available, I expect they will have similar problems with 20nm and certainly with what they call 16nm.
http://www.theverge.com/2013/11/6/5072242/samsun-2014-phones-will-have-78-percent-more-pixels
samsung roadmap mentions their AP will be on 3d finfet in 2014. either they are using intel as foundry or tsmc has cracked this. interesting