During IR to present yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. TSMC had finished developing 16-nano FFC process in 4th quarter of last year. Co-CEO C.C Wei of TSMC explained that 16-nano FFC process focuses on reducing production cost more than before and implementing low electricity.
...By adding FFC process, TSMC now has total of 3 16-nano processes.
We are going to develop a derivative process that will follow Gen.2 14-nano process and lead mobile chip and foundry markets. said Vice-President Bae Young-chang of Samsung Electronics System LSI Business Departments Strategy Marketing Team.
Unlike 32-nano and 20-nano processes, it seems that 14 and 16-nano processes will become longevity processes because it has become difficult to reduce line width as processes are entering 10-nanos. If it is not easy to secure yields, then it is going to lead to increase of cost for production of chips. This is why 28-nano process is still the main process after long years.
It is predicted that Samsung Electronics and TSMC will develop Gen.3 14 and 16-nano derivative processes and focus on securing customers before they finish developing high-tech 10-nano process at the end of this year. said a representative of this industry. Even if 10-nano process is commercialized, there still will be many fabless businesses that will use 14 and 16-nano processes that cost relatively cheaper.
http://english.etnews.com/20160121200001
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