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Tons of Hammer/Hammer mobo pics @ AMD Zone w/writeup

Why is the Sledgehammer using the old ceramic packaging? That doesn't make any sense to me. Especially since the ClawHammer is using organic packaging. Why wouldn't they use the same packaging?
 
Anyone else notice the clipping mechanism on the HSF? It was just two screws holding it down, wouldn't that be easier to do than using a screw driver they way it's not suppose to be used 😀

EDIT: I just read it, nm.
 
nice find nfs4 thanks man

i hope these are as good as they sound me wants one now

what will this mean to gaming/photo editing/video capture/rendering>The high performance workstation layout is what many enthusiasts will want as a guilty pleasure but probably won't really need. You can put me in that group. This will become the system of choice for the intelligent power user for any application that screams for high memory bandwidth, SMP, and FPU power. Get the Dell out of here! Here again the most of HyperTransport put to use at 6.4GB a second while PCI-X and the I/O hub is joined by the AGP 3.0 graphics tunnel.

<< This will allow for AGP 8X support at a full 533MHz >>

. While this is designed for Sledgehammer/Opteron expect Clawhammer workstation class motherboards to have a similar setup. I can't wait for the Tyan Thunder K8 to hit the test lab!

533mhz would this help in any way now or only in the future
 
hahah thats funny that you said that.
uhm... the hammer is a masssive step AWAY from following Intel.... tee hee
 
of course, they always follow in intels footsteps, hehe

One should keep in mind that the first ever flip-chip packaged x86 CPU with a heat spreader was the AMD K6, so it is in fact the other way around 🙂
 
oh give me a break, you also probably think AMD was first with a .13micron cpu as well. I own an AMD system, but face it, they always are behind technology wise. the k6 was not a core flip, it just had a heat speader on top of the ceramic, that looks almost identical the heat spreader on AMD mp chipset

fc-pga was a reversal in the direction of the core packaging.
 
btw, i never owned k6. im just going on by what i remember about the cpu. if there was indeed a core(similear to the celeron or athlon) under the heat spreader, than i stand corrected. until intel reversed the packaging, i wasnt aware of anyone doing it the other way around.
 
I've uncapped a K6-2, and it is a flipchip style core.



<< oh give me a break, you also probably think AMD was first with a .13micron cpu as well. >>



yeah, and you probably think Intel was the first huh?

Via/Cyrix beat them both, and I think Transmeta did too 😛
 
flip-chip = core on top of the packaging, core facing downwards so that interconnects are buried

K6 did indeed come with the core on top of the packaging before the P2 family of Intel did the same thing on their socket design. Technically the P2 laptop and slot-1 processors used flipped chip-like core mounting. Prior to the P2, Intel CPU's used exposed interconnects. I have removed a few cores from 486s through P2's and the interconnects are much different from one to the other.
 
K6/K6-2/K6-3 is indeed a flip chip with a heat spreader. I chopped the heatspreader off my K6-2 and consequently cracked the core when putting the heatsink on. Foreshadowing?
 


<< I chopped the heatspreader off my K6-2 and consequently cracked the core when putting the heatsink on. Foreshadowing? >>



Wow you were ahead of your time.😉
 
I would guess the multiplier is locked on these CPUs. Unless someone comes up with some fancy pin mods, could the days of easy to OC AMD CPUs be fading away? Anyone have any info?

Windogg
 
learn something new everyday 🙂



<< yeah, and you probably think Intel was the first huh? Via/Cyrix beat them both, and I think Transmeta did too >>



I guess I should have been more clear on that. Intel delivers mass market, consumer scale. Those companies cannot compete. Transmeta is all but dead. Delivering a few samples is much different than delivering a product mass market at a price point consumers will jump at. AMD and Intel are the main course. Everything else is just left-overs
 
Clawhammer will most lilely be my next upgrade at the end of this year 🙂. Performance-increase from my current 800MHz Duron should be quite noticeable (keeping in mind that I'm planning to (among other things) quadruple the amount of RAM)....
 
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