Originally posted by: Zap
I have a theory about this kind of thing. It is probably propagated by people having crappy temps and reading about how lapping can magically decrease temperatures. So, they take apart the system they built 6 months ago and remove the heatsink (and blow out the fan/fins with compressed air while they're at it) and then remove the gooped on thermal paste (hey everyone starts out a noob) and lap their CPU and heatsink. Then they carefully (now that they're no longer a noob) put a thin layer of thermal paste on and install the heatsink, and get magically lower temperatures.
That's my theory and I'm sticking with it. :evil:
We are dealing with masses of people, so naturally there will be a distribution of reasons and results.
I say that because I want to agree with you and preserve your opinion while adding the firsthand result of my own lapping experience which would contradict your statement (and I don't want to do that).
In 2007 I bought the hardware to buy five identical Q6600 rigs, same mobo, same ram, same hd, etc. With 5 rigs I valued "quiet" while at the same time I valued OC speed. I also valued not heating my home up 10C from my 6 quads (I had a QX6700 already).
Lower temps makes for lower Vcc stable rigs at any given clockspeed. That's straightforward device physics. You drop your operating temps 10C and you can decrease your Vcore while remaining stable at the same GHz. At the same time a drop in temps means you can run your case fans and/or HSF speeds all the lower and keep those decibels low.
So I went about systematically determining just how much lapping and which thermal paste, etc, I needed. I did no lapping but tested AS5, ceramique, TX-1, and TX-2. I lapped just the IHS on some, on others I just lapped the HSF. Still on others I lapped both.
On my better lap jobs, where I went to 1500 grit and really worked hard to get a flat surface, I found I did not need TIM at all and my temps were the same. I still used TIM though, simply because I had it. AS5 because it is the easiest to remove IMO with the artic clean solutions. TX-2 is like removing putty, PITA.
At any rate all said and done because I lapped I was able to run my Q6600's (all 5 of them) at their stock VID settings while overclocked to 3.3GHz (9x367) with the temps never breaking 60C on small FFT with the Tuniq fan manually turned down to 800rpm. Before I lapped I could hit 3.3GHz but it took more Vcore and I had to crank up the fans just to keep the temps in the high 70's with small FFT.
For me and what I cared about (power consumption and noise), lapping made a difference in the metrics I cared about.
But it is a very subjective process, no two people will lap their chips in exactly the same way, so to be sure there will be folks who got frustrated and did a rush job and ended up with a crappy experience from their less than stellar lap job. Or as you say, their benchmark for what a non-lapped system is like was also handicapped by the user being at a point on the learning which still had a considerable first-derivative.
But making the argument that lapping an IHS or HSF makes no difference is equal to arguing that all TIM's really have the same thermal conductivity and it is just user error that accounts for the measured differences.