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Tiny hole in P4?

T

TOCSYS

Senior member
I'm guessing that this hole is used to to vent heat. I'm about to install a new HSF and I want to apply Arctic Silver II to the processor but I'm unsure if I should avoid the hole. Should I just lap it on everywhere but the hole or will covering over it not matter?
 
Don't worry about the hole man. under that heatspreader is just a die, kind of like how a PIII (FC-PGA) looks like. If some Artic Silver gets in there it won't do any harm since there is nothing in there that will short.
 


<< the hole creates a vacuum and sucks the heatsink down onto the spreader. >>



Care to explain how?
If anything, air near the processor will get warm and extend, doing exactly the opposite of what you said...
Plus a small hole will never create the force necessary, since F = p*A. Even with a perfect vacuum inside, p = 10^5 Pa, and with a hole of about 1 mm^2 or 10^-6 m^2, the force is F=0.1 N, which is NOT enough to pull a heatsink down. It's not enough to push a feather of the ground either, for that matter.
Now, we don't have a perfect vacuum. Creating pressure on the heatsink is still the job of the screws.

As a moderator, you should really research your posts better.
 
The hole is there because gasses can form when the IHS is bonded to the core, and they need to be allowed to escape, or else the pressure will crack the core/packaging when the chip is put into service.

Kramer
 


<< The hole is there because gasses can form when the IHS is bonded to the core, and they need to be allowed to escape, or else the pressure will crack the core/packaging when the chip is put into service.

Kramer >>



this is also what I have been told.
 
Plus a small hole will never create the force necessary, since F = p*A. Even with a perfect vacuum inside, p = 10^5 Pa, and with a hole of about 1 mm^2 or 10^-6 m^2, the force is F=0.1 N, which is NOT enough to pull a heatsink down.

What's with the calculus?
 


<< Plus a small hole will never create the force necessary, since F = p*A. Even with a perfect vacuum inside, p = 10^5 Pa, and with a hole of about 1 mm^2 or 10^-6 m^2, the force is F=0.1 N, which is NOT enough to pull a heatsink down.

What's with the calculus? >>



no calc there, just physics 😉.
 


<<

<< the hole creates a vacuum and sucks the heatsink down onto the spreader. >>



Care to explain how?
If anything, air near the processor will get warm and extend, doing exactly the opposite of what you said...
Plus a small hole will never create the force necessary, since F = p*A. Even with a perfect vacuum inside, p = 10^5 Pa, and with a hole of about 1 mm^2 or 10^-6 m^2, the force is F=0.1 N, which is NOT enough to pull a heatsink down. It's not enough to push a feather of the ground either, for that matter.
Now, we don't have a perfect vacuum. Creating pressure on the heatsink is still the job of the screws.

As a moderator, you should really research your posts better. >>




Ohhh there goes my head. Math! AHHHHHHH 😀
 


<<

<<

<< the hole creates a vacuum and sucks the heatsink down onto the spreader. >>



Care to explain how?
If anything, air near the processor will get warm and extend, doing exactly the opposite of what you said...
Plus a small hole will never create the force necessary, since F = p*A. Even with a perfect vacuum inside, p = 10^5 Pa, and with a hole of about 1 mm^2 or 10^-6 m^2, the force is F=0.1 N, which is NOT enough to pull a heatsink down. It's not enough to push a feather of the ground either, for that matter.
Now, we don't have a perfect vacuum. Creating pressure on the heatsink is still the job of the screws.

As a moderator, you should really research your posts better. >>




Ohhh there goes my head. Math! AHHHHHHH 😀 >>



Damn RSMemphis ... you really punked him .... heheeh and hey tex 😀

SSXeon
 


<< Don't worry about the hole man. under that heatspreader is just a die, kind of like how a PIII (FC-PGA) looks like. If some Artic Silver gets in there it won't do any harm since there is nothing in there that will short. >>


Aren't Arctic Silver and most thermal pastes non-conductive

Looks like Intel made the hole offset on a corner so that if air does expand, it will seep to the side easily. It's then less likely to form air bubbles like it would if the hole was in the center.

The hole can maybe act as a thermal paste reserve analagous to the grooves on the pistons to an engine. That would mean the hole's stored thermal paste ensures the contact with the HS. But it's still ridiculous to assume that... which is why I believe it's part of the manufacturing process as stated above.
 
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