thilanliyan
Lifer
- Jun 21, 2005
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Originally posted by: chizow
Well its obvious you're not interested enough to do your own research, so this is the last time I'm going to feed it to you since this is already OT. The move to Jasper was only a GPU shrink of those 3 components, the shrinks to the CPU and eDRAM already came with the move from Xenon to Falcon.Originally posted by: thilan29
Jasper was a GPU + memory shrink so it wasn't all due to the GPU:
http://gear.ign.com/articles/826/826652p1.html
And you have no idea what percent of the total load is from the GPU so you have no idea how hot it actually runs (ie. you're making "fireball" claims without proof).
Also, that still doesn't answer who was actually responsible for the inadequate cooling. Obviously MS approved the ATI design. There's no way MS would have used their design if they didn't think they could cool it.
AT article
360Rev CPU GPU eDRAM
Xenon 90nm 90nm 90nm
Falcon 65nm 80nm 80nm
Jasper 65nm 65nm 80nm
While inadequate cooling certainly contributed to the issue, the cause is still undoubtedly the excessively hot GPU as a cooler running GPU might not have resulted in the GPU melting away the solder and physically dismembering the chip from the board. This is all well-documented in the links I provided that also give the failure rates, as techs in the RMA departments were describing what they were seeing with RROD machines.
Now compare this to the Nvidia problems. Are you assigning blame to the notebook makers, or the GPU maker?
My mistake about the memory but as I said, you still don't know how much power the GPU was dissipating relative to the cooling capacity. Since MS obviously tested the chip before putting it into the 360 they should have had an idea of what kind of cooling they needed but obviously they decided to cut some corners and I'm fairly certain they wouldn't have approved the chip for use if it ran too hot in their testing. Of course a cooler running GPU might not have resulted in the problems but you don't know whether that was because of inadequate cooling or whether it was dissipating a lot of power.
From what I've read about the RROD, it's caused by warping of the motherboard and subsequent cracking of the solder bumps due to the tension created by the warped motherboard. The solder bumps were also embrittled due to:
1)inadequate cooling
2)GPU running too hot
Actually both 1&2 would be taken care of by adequate cooling and I'd put the blame on MS (and they seem to think so too given they've shouldered the full cost of the extended warranty and repairs) since they were responsible for the design of the case and cooling. In the nV case wasn't it due to the specific type of solder bumps they were using (wasn't it nV who prescribed those?) (even in this case nV have shouldered the full cost so wouldn't the blame be in their hands?)?