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thoroughbred may prove to be harder to cool than xp chips....

M

Mikewarrior2

Diamond Member
Translated ZDNet Germany site with Thoroughbred heat numbers


DOesn't look too pretty... 10% overall drop versus XP chip, but it runs .1V lower....
an XP chip at 1.65 runs roughly the same "heat" as a thoroughbred of the same speed at 1.65V.

now the really ugly part. Thoroughbred cores are rumored to be 80sq mm's. Current XP cores are 128 sq mms.

Wattage per sq cm of a thorougbred is roughly 75. Wattage per sq cm of an XP chip is roughly 52.

Meaning, the thoroughbred, if these numbers prove true, makes the heatsink contact surface, interface material, lack of DIE damage, lack of heatsink damage so much more critical than with an XP chip....

Some food for thought for those waiitng for a thoroughbred before you upgrade... it may end up that overclockign with a t-bred is harder than overclocking with an XP.


Mike
 
Interesting read. Thank you. Guess we will have to see what happens when these get into the real world and the temps range from 25c-60c with everyone! 😉
 
Aren't the new athlons going to have heat spreaders on them? I thought I read somewhere that they were. With the die shrink they almost have to. That should solve the problem of core cracking and heat dispertion.
 
A heatspreader would solve the problem of cracked cores, but not heat. The contact area the core has with the heatspeader is still the same as the contact area it would have directly with a heatsink.
 
yeah, a heat spreader isn't going to solve the heat problems iwth it.... you're still taking about a very sizeable heat contact surface reduction without a sizeable heat output reduction....



Mike
 
Now if only we could sandwich the die between two heatsinks... it seems remarkable already when I look at the die of a Tbird and realize that the heatsink has to pull about 60W through that tiny area. The heat spreader will solve the problem of cracking the die, of course, but it adds another thermal interface to the stack (die>TIM1>spreader>TIM2>heatsink, rather than die>TIM>heatsink).

Maybe AMD will think outside the box. I wonder if they could encapsulate some heat-pipe fluid under the spreader with the die, to move heat out to the edges of the spreader more efficiently.
 


<< Now if only we could sandwich the die between two heatsinks... >>

Heh, I was rummaging around AMD's site and I learned something 🙂D): AMD mobile CPUs are sandwiched between two heatsinks. :Q Or they can be, anyway. Methodologies for Measuring Temperature on AMD Athlon? and AMD Duron? Processors On the bottom of page 64 edit: 'scuse me, I meant top of page 65, sorry, it shows a side view of their setup. I've never had a laptop apart... anyone know if this is a new practice or not?
 
And the other problem with the heatspreader is if they use cheap thermal grease between the core and the spreader, which is what they did with their K6-x processors. I've popped some open - it's a grey rubbery substance. The spreader is glued at the corners, and some of the glue is put right on the core.
I had an idea awhile back to put something like a small integrated "shim" around the processor. There's already that greenish sealant around the core; well I had an idea for AMD to build that up so that it would surround the core at just the right level - it would act as a shim permanently attached to the processor. No core chipping, and less heat-transfer problems.
 


<< And the other problem with the heatspreader is if they use cheap thermal grease between the core and the spreader, which is what they did with their K6-x processors. I've popped some open - it's a grey rubbery substance. >>



I think the grey thermal compound is Aluminum oxide thermal compound. I don't know if anyone sells that crap anymore... I still have a syringe of it from www.coolerguys.com 🙂

IMO, an IHS just adds another thermal impedance to the equation... everything is better without an IHS.
 


<<

<< And the other problem with the heatspreader is if they use cheap thermal grease between the core and the spreader, which is what they did with their K6-x processors. I've popped some open - it's a grey rubbery substance. >>



I think the grey thermal compound is Aluminum oxide thermal compound. I don't know if anyone sells that crap anymore... I still have a syringe of it from www.coolerguys.com 🙂

IMO, an IHS just adds another thermal impedance to the equation... everything is better without an IHS. >>




hmmm I can imagine people posting many many many.. "HELP!! I cracked my Thoroughbred!!!, how do I commit fraud without getting caught? I want to blame my boo-boo on AMD"
 
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