This is embarassing...

[Zebo]

I would use LN2. Dip HS, not precessor, upside down into LN2 and the subcritical temps should break bond with a simple twist..

What processor was it (hav'nt read whole thread just your OP)

Oh BTW check out www.dell.com

 

[IlllI]

maybe try this

 

[Zebo]

nm

 

[yekuza]

Originally posted by: Zebo
I would use LN2. Dip HS, not precessor, upside down into LN2 and the subcritical temps should break bond with a simple twist..

What processor was it (hav'nt read whole thread just your OP)

Interesting suggestion, something I might want to try if I end up getting the CPU out of the socket with the HS still attached. The CPU is a Athlon 64 3200+. Epoxy breaks down at both high and low temps?

Oh BTW check out www.dell.com

'Scuse me, is that suppsed to be a jab?

 

[Zebo]

Breaks down at high like 300C but you won't get that high w/o damaging what you're trying to save. Shrinks at low temps breaking the hydroxyl pendants adhesion to substrate such as your processor.