- Mar 11, 2004
That's my point though, if you reduce the layers, you reduce the potential for issues like that, so I would think would be beneficial for that issue even. Funnel heat from the die to the largest component of the heat exchange as directly as possible. Let the heatsink spread the heat out. So you find a way to make the TIM as thin but even (and consistently able to), so that the heat from the die is making as direct of contact with the main and largest heat dissipation aspect as possible. You can spread the heat out with it, you simplify install (which will also help with cooling, especially over time).Generally speaking, no. You want effective dissipation along as many axes as possible, even for thin interface layers (such as TIM/thermal pads). If they're going to use graphite, they may as well use CNTs or something similar that can conduct heat well along multiple axes. Synthetic diamond would also be an option (and it's actually rather cheap; so is industrial-grade diamond). When you have hotspotting, you definitely need lateral dissipation, to help heat spread into underutilized parts of the thermal interface.
I think you might be focused on the sponge part of what I was saying? Let's just talk about one of these thermal sheets between the die and heatsink, wouldn't that provide better cooling than including the solder (or other TIM) and heatspreader? That's what I'm saying.