If it doesn't support full-throughput AVX, it doesn't support AVX for the purposes of discussing TDP. How you feel about consumer software or Intel market segmentation has nothing to do with this.That is just plain wrong. Zen supports AVX2. As my Ryzen will testify.
In fact, AMD already supported AVX with Bulldozer, and their own XOP.
Nobody needs to snap any fingers. Motherboard manufacturers will do it because their product will be superior to the competitors. What do you think the difference between an ASUS Maximus 9001 and a basic Z270-A is?Sure they can just snap their fingers and have motherboard manufacturers create a consumer enthusiast motherboard requiring twice the out put they currently supporting and 33% more than they have been supporting on max over clocks. All within fitting current case and power supply standards.
An LGA-1151 socket can already deliver over 200 W of power. Why do you think a LGA-2066 (which btw is not a "consumer" socket) can't deliver the same power? In fact, one thread over on this board, you can find fellow enthusiasts overclocking the E5-2699v3 and moving over 300 W through LGA-2011v3.I can see this might be a bit pointless to explain but just like clocks on a CPU. The higher you get the requirements get that much more extreme. That 50% increase in Power will cost that much more to develop and implement than the 200w before it. You can't compare a consumer platform with a platform made to fit specific use cases that is tons more expensive and made to order.
Point. Neither of them do. TDP is about cooling requirements and limited max power output isn't as important figuring out the cooling requirements. The point is that Ryzen can sit close to 4GHz with 8 cores (double a 7700K) at the power output of the 7700 at 4.5. A 12 core Ryzen is 50% more cores, a 12 core i9 would be 3x the cores. My point was AMD keeping the HEDT cores at the retail speeds of of their R7 lineup would be much more manageable.
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