It seems to me that the computing industry, with their steadily increasing clock ratres, are slowly but surely running into a limit of how to effectively dissipate the heat generated by the components - the cpu's and gpu's in particular. And while it's true that shrinking the die alleviates this problem to an extent, we are still seeing higher and higher cooling requirements for modern processors, and especially video cards. So, thinking a few years ahead, what kind of developments can we expect to see in this area?
One recent feature I see is the movement to multiple components doing the job simultaneously. For example, SLI for videocards, and multiple-core processors. So, I want to hear what you guys think about this issue, and if anyone has heard of what else might be with this in the future.
One recent feature I see is the movement to multiple components doing the job simultaneously. For example, SLI for videocards, and multiple-core processors. So, I want to hear what you guys think about this issue, and if anyone has heard of what else might be with this in the future.