GaiaHunter
Diamond Member
- Jul 13, 2008
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Yes, but what is the relevance?
The physical properties are equal despite of die size - it uses the same wafer.
Additionally, the 4770 didn't have any problems in terms of performance or power consumption or OC - it was quite a good card. It simply had yields problems.
The relevance here is that vias low tolerance exists regardless of die size.
No, I'm pointing out that you can still have yield/scaling/performance/power consumption issues, even if your manufacturing process is the best in the world.
Yield on a given process is indeed dependent of the die size.
This http://forums.anandtech.com/showpost.php?p=28800897&postcount=38 is a good post by IDC related to Yields, how die sizes affect yields and defects.
The power consumption and performance can be related or not.
Which is why I referred to Pentium 4 vs Core2 Duo. Both built in the same foundries on the same process.
Just like GF100, GF104, Cypress, Juniper and RV740.
And what if GF100 was in a similar situation?
Well P4 got killed. Maybe (and it seems somewhat likely) GF100 gets killed by a much more efficient GF104.
I don't think you quite understand this part.
"Architecture performance"? We don't really know, do we?
What was nVidia's actual goal in terms of performance and power consumption?
With Intel we clearly know that they were aiming for 5+ GHz with the Pentium 4. Perhaps nVidia was aiming for higher clocks aswell, but had to cut it short because of power consumption issues due to excess leakage, much like the Pentium 4.
But by the same token we don't know for what performance levels and power consumption AMD was aiming - AMD did hit power consumption (apparently) and at least sp count, though.
As I said 'initially' (4770 was a long long time ago). What if these problems were long solved by nVidia, just as ATi solved them? (nVidia's GT215 is a 727 million transistor chip, not that far from the 829 of the 4770, and because of lower density, it actually has a slightly larger die size (139 mm^2 vs 137 mm^2. In fact, I could hypothesize that this lower density is a result of using double vias).
We don't know, because there is no data on this.
But assuming they did fix them, we still have the problem that GF100 is a considerably larger chip than anything ATi manufactures.
Well, the GF104 is also lower density than Cypress and GF100. Cypress does indeed have double vias (and it is the highest density part).
We don't know, because there is no data on this.
But as I indicated, the GF104s that are currently being sold, don't show any signs of poor yields, due to various factors (good supply, good overclockability, decent power characteristics). We'll know soon enough, when a full version is released (nVidia used this same strategy before, with G92 and GT200, neither had significant yield problems, they just ramped up the SPs slowly). Perhaps there will also be a way to unlock current GF104s then, so we'll be able to see how many of them unlock successfully.
Few things:
The 4770 had crap yields and no problems in the power consumption and OC departments.
Additionally, the GF100 OC well (high leakage chips generally do).
The facts is that we don't know if GF100 problems will be solved with a shrink or not. If both GF100 and GF104 use double vias, then it seems worse for GF100 even with a die shrink (and that is if the 28nm process isn't plagued with problems either). If you compare Cypress with Juniper, Juniper isn't more power efficient than Cypress, despite being quite smaller.