Whats better, spread the thermal compound all over the CPU with...say a presentation card....or let the heatsink do the work?
Spreading thermal compound or not?
- Thread starter Relion
- Start date
Hacp
Lifer
- Jun 8, 2005
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I always put about 4-5 dots on the CPU on the four corners and the middle so it can spread itself and also cover the whole IHS. I don't know why people swear by the one dot in the middle method, as that is very ineffective in covering the whole IHS. I can see why you would put one dot if it were just the core(mobile chip), but if it has an IHS, it doesn't make sense.
You don't want 5 "dots" of compound. When you attach the heat seat, those 5 dots will spread out and the chances are good that you'll trap air bubbles between those dots, and air makes a very poor conductor.
Follow the directions on the articsilver site. My AMD X2 3800+ consistently runs at a nominal 32°C consistently.
Follow the directions on the articsilver site. My AMD X2 3800+ consistently runs at a nominal 32°C consistently.
Rule of thumb:
IHS => dot in the middle approach is okay, spreading thin layer evenly made no difference for me
Directly on core => apply thin layer evenly with razorblade
IHS => dot in the middle approach is okay, spreading thin layer evenly made no difference for me
Directly on core => apply thin layer evenly with razorblade
Ceramique doesnt have any silver in it.. so the link is good no matter what compound you use.
http://www.arcticsilver.com/ceramique_instructions.htm
JEDIYoda
Lifer
- Jul 13, 2005
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Actually you should apply all thermal compounds according to the way each brand recommends.....
Just because ceramique has no silver in it is no reason to ignore application directions for each brand.
If you notice the directions for applying the thermal compound that come with the various hardware such as after market Heatsinks or video card coolers......
Unless you are using a AS product.
Good Luck!
You should really follow those directions becuase NOT all thermal compounds spread the same way or react the same way even though the basic properties are the same.
JEDIYoda
Lifer
- Jul 13, 2005
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Umm actually no.....
Alot of us who have used AS thermal compounds and other products have found that the supposed benefits to be just that supposed...
You may provide links and such to back up your supposition that AS is the best yet those of us who have used both will tell you thats just not so....
Yet others will say it is so.
Then you will still find other who....
Will have been using a heatsink and it will have been in need of a proper cleaning and removal and then upon reinstallation using the AS products they all of a sudden miraculously are getting 10c to 20c lower than what they were using before.
Yet if you stop to see whats wrong with that picture its actually quite simple....
They removed there heatsink....
They cleaned there heatsink of dust and debris....
They cleaned the OLD thermal paste off the CPU
Then they reinstalled the heatsink on a clean surface with fresh thermal paste.
Good Luck
CraKaJaX
Lifer
- Dec 26, 2004
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When I first got my XP-120 I spread it myself, put too much on... my CPU was idle @ around 35-36c. I decided to try the "BB size" drop in the middle of the CPU and let the HS spread it, I'm idle at 29c right now. I would definitely go with letting the HS spread it itself.
Originally posted by: Budman
that's the correct way to do it.
I always spread it out on my toothbrush before I brush my tooth
Gamingphreek
Lifer
- Mar 31, 2003
- 11,679
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I get a plastic zip lock bag, put my finger in it and spread it out evenly across the core. Then i get any excess off with the edge of a paper, leaving the surface extremely smooth. Then i put the HS/F unit on and enjoy.
Just plopping the HS/F on is a good way to trap air and not get an even spread across the CPU (unless your CPU is circular). Always spread it yourself.
-Kevin
Just plopping the HS/F on is a good way to trap air and not get an even spread across the CPU (unless your CPU is circular). Always spread it yourself.
-Kevin
Gamingphreek
Lifer
- Mar 31, 2003
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Why are you following me around? Do you have anything whatsoever to contribute to this thread...i thought not.
-Kevin
There IS one best way to do it. I'm not sure what it is, but it shouldn't depend on the composition of the TIM unless the roughness of the mating surfaces is relatively high.
Gamingphreek
Lifer
- Mar 31, 2003
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The dot method. Prevents air bubbles, and gets the only part of the IHS that matters -- the part over the core. As long as you've got good heat transfer between the area of the IHS directly over the chip (and maybe a bit around it) you're fine, which is why many waterblocks don't even cover the entire surface of a chip.
-hc-
-hc-
Gamingphreek
Lifer
- Mar 31, 2003
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How does simply plopping a HS on top prevent air bubbles??
The only sure way to prevent air bubbles is to do it the lengthy way i suggested.
As for where. On the A64's unless you remove the IHS you must cover the entire IHS. That is why it is there. To dissipate heat from the core over that larger surface area, therefore you must cool the entire thing unless you remove it where only the core is accessable.
-Kevin
mindless1
Diamond Member
- Aug 11, 2001
- 8,764
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Do not use thick compound. That is rule #1 and thus, you will not ever have to spread it (even if you did, it would prevent best contact between CPu and 'sink).
By thick I mean thicker than Arctic Silver/Alumina/etc, like old silicone grease. Further, do not use silicone grease on flipchips without a spreader, it will pump or dry out over time with today's high-heat-density cores.
Do not use heatsinks with an irregular surface unless (arguably) forced to do so - for example on proprietary video cards the base is sometimes bad but can only be lapped so much due to the design.
With the proper viscosity of compound, a very small amount should be placed in the center of the core. Not a blob that looks like an icre-cream cone, not spread out over a large area like frosting a cake, just like an itsy-bitsy pancake in the middle of the heat spreader or almost to the edge on cores without spreader. You are not trying to create a uniform thickness, the edges of this pancake should be see-through and only the middle opaque, but on the other hand you don't have to play around in it to try to achieve this ideal state, just an indication of how much to use and where it goes.
The (potential) mating area between an IHS and 'sink base is far too large to allow optimal interface by spreading compound over the entire spreader. That guarantees the compound is thicker than it otherwise would've been, and with that much surface area the heatsink retention force is not enough to squeeze out all of the excess.
Now about using a credit card or plastic baggie or any other special tools- don't be silly, there has never been any valid test proving that matters. If you have so much crud on your hands that you think "stuff" is going to come off in the compound, wash your hands! Oils from fingers- not significant unless it's been a long time since you've washed your hands. If you really like playing with special tools, they will work ok, providing application is still thin and in middle only, but they're not necessary.
By thick I mean thicker than Arctic Silver/Alumina/etc, like old silicone grease. Further, do not use silicone grease on flipchips without a spreader, it will pump or dry out over time with today's high-heat-density cores.
Do not use heatsinks with an irregular surface unless (arguably) forced to do so - for example on proprietary video cards the base is sometimes bad but can only be lapped so much due to the design.
With the proper viscosity of compound, a very small amount should be placed in the center of the core. Not a blob that looks like an icre-cream cone, not spread out over a large area like frosting a cake, just like an itsy-bitsy pancake in the middle of the heat spreader or almost to the edge on cores without spreader. You are not trying to create a uniform thickness, the edges of this pancake should be see-through and only the middle opaque, but on the other hand you don't have to play around in it to try to achieve this ideal state, just an indication of how much to use and where it goes.
The (potential) mating area between an IHS and 'sink base is far too large to allow optimal interface by spreading compound over the entire spreader. That guarantees the compound is thicker than it otherwise would've been, and with that much surface area the heatsink retention force is not enough to squeeze out all of the excess.
Now about using a credit card or plastic baggie or any other special tools- don't be silly, there has never been any valid test proving that matters. If you have so much crud on your hands that you think "stuff" is going to come off in the compound, wash your hands! Oils from fingers- not significant unless it's been a long time since you've washed your hands. If you really like playing with special tools, they will work ok, providing application is still thin and in middle only, but they're not necessary.
My 2c
The reason spreading isn't as effective is because it does exactly the opposite as one might think, incorperates air. An accurate analogy would be spreading cake frosting which has a similair consistancy. It's spread to specifically incorperate air which makes it "fluffy" like a kitty kat.
All kidding aside a little known fact is that many IHS and/or heatsink bases have a very slight convex or concave surface. Lapping a base and giving it a perfect sheen does not necessarily indicate it's "flat". That's another attribute all together.
Only placing a small dollup in the very center of the IHS will ensure two things.
1. natural compression will force air OUT simulataneosly forcing thermal paste into micro-pores in the IHS surface directly above the core
2. natural compression will force air out while simultaneosly forcing thermal paste into micro-pores in the heatsink base
The extent of "saturation" (filling of striations and micro-pores) will of course depend heavily on two conditions
1. the amount of curvature (convex/concave) in both surfaces
2. amount of and consistancy of pressure
There's only one scenario where spreading may be necessary and that is using Nanotherm PCM+
The reason spreading isn't as effective is because it does exactly the opposite as one might think, incorperates air. An accurate analogy would be spreading cake frosting which has a similair consistancy. It's spread to specifically incorperate air which makes it "fluffy" like a kitty kat.
All kidding aside a little known fact is that many IHS and/or heatsink bases have a very slight convex or concave surface. Lapping a base and giving it a perfect sheen does not necessarily indicate it's "flat". That's another attribute all together.
Only placing a small dollup in the very center of the IHS will ensure two things.
1. natural compression will force air OUT simulataneosly forcing thermal paste into micro-pores in the IHS surface directly above the core
2. natural compression will force air out while simultaneosly forcing thermal paste into micro-pores in the heatsink base
The extent of "saturation" (filling of striations and micro-pores) will of course depend heavily on two conditions
1. the amount of curvature (convex/concave) in both surfaces
2. amount of and consistancy of pressure
There's only one scenario where spreading may be necessary and that is using Nanotherm PCM+
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