According to Silicon Lottery, deliding has a minimal effect on temperatures of the 9900k. The heat issues come from the fact that there are 2 more cores to deal with and the cpu is capable of very high clockspeeds.Having an 8700k and reading what i’m reading about the 9900k. Getting any satisfaction from this upgrade (sidegrade?) would involve delidding and lapping IMHO.
So apparently it seems that even though they went back to solder which is what everybody wanted they managed to increase the thermal resistance of this setup?
The silicon die is thicker and the solder somehow prevents efficient transfer of heat?
So this company spending billions of dollars and struggling to deliver upgrade options for its gaming market is delivering this kind of construction in the CPU and IHS?
How about maybe taking some pocket change out of the billions they spend on R&D and maybe design a package that optimizes the removal of heat from the CPU?
Are they saving that ace up the sleeve for their next screwup?
We have suffered for years with this horrible design. Would it really cost them too much to ensure the die is prelapped and fully flat? To include a liquid metal TIM and copper IHS that is also flat?
On an industrial scale maybe $20 extra? I know that’s a lot of money. But we are talking about top end chips for gamers. Maybe $100 premium? It would certainly cost more to have it done by any independent service.
Is there something about offering that which is not feasible?
Right now they could make a 10000k which is a 9900k just properly lapped and sell it for $599. If people are paying $499 why wouldn’t they pay $599?
The coolers such purchasers buy are $150-450. Some people say they are running 3x360 loops. The issue is the CPU to Block heat resistance.
Given the huge engineering challenges they have which need $billions to overcome why would such a low hanging fruit be left just lying there?