http://forums.anandtech.com/showthread.php?t=2261855
Read through IDC's posts and you should have a better grip on this. Yes there are (major) improvements to be had with (major amounts of) time and work invested. As stated, the decisions made really didn't effect stock settings, but more or less eat into the headroom of the chips. While I personally feel Intel would be better served to toss some bones to the enthusiast crowd (since I'm a member of said crowd and could only stand to benefit), it really isn't going to effect their bottom line all too much. If they were losing performance wise to AMD, yeah sure sound the alarm, but they have been lapping them around the track for quite some time now and cheaping out/gimping the OC headroom on chips that are already the fastest X86 products on the market isn't going to bite them too hard. Chalk it up to "Intel being Intel".
i think he's talking about with the IHS intact.
IDC only showed what we used to do back in the old days called delidding.
And to be honest, on the new cpu's it might be a merit.
However on the i7's it was a waste of effort.
And op, whats better solder or tim?
Lemme ask you this question then.. what do you think can transfer better? metal or oil?
You just answered your own question.
Solder transfers better, and intel's solder they used to use, turned liquid at around 75-77C.
Also having a better transfer branch isnt worth it, if your sink cant keep up with the large delta to benefit from it.
Also delidding does come with its own can of worms... i have cracked a few DIE's before from mounting on a waterblock too hard for mount pressure...
Something which isnt possible if i had an IHS.