Oh, I get it. If Intel is measuring a strange Tcase/IHS that is between heatsink and CPU. We can have two different thermal conductivietes, of which one would be extremely revealing. Both also combine to the total thermal resistance.
\\\\ Heatsink or TTV ////
[Thermal Resistance
ΨCA]
______IHS / Tcase_____
[Thermal resistance
ΨCA]
____Junction / CPU_____
So I dug up the really boring one, the thermal resistance of the crappy Intel cooler or test vehicle. Secretly hoping that perhaps it would describe total thermal resistance. Without the Intel Thermal Test Vehicle (inluding TIM) we cannot even test total resistance or
determine ΨCA.
That said Intel seems to be referencing a much better heatsink with low thermal resistance 0.22 °C/W for Skylake.
http://ark.intel.com/compare/80807,88195
Which you originally stated and it is now confirmed.
We're talking about 2 different regions here. You are talking about case to ambient (ΨCA) TIM and cooler, while I'm talking about junction to case (ΨJC) CPU.
For the 4790K @ 84W and 0.381°C/W, local ambient @ 40°C then
84 x 0.381 + 40 = 72°C. Case temperature (Tcase).
From the same table for maximum Tcase with a local ambient @ 45°C we need better cooling, 0.33°C/W (ΨCA).
84 x 0.33 + 45 = 72.72°C. Tcase
Now this is typically calculated at DTS = -1 which means as the temperature target (Tjmax) is 100°C then core temperature is at 99°C. Any higher and thermal throttling should take place unless it has been disabled or an offset to the temperature target has been applied.
So if at 84W core temperature is 99°C and Tcase is 72.72°C then
99 - 72.72 = 26.28°C. Temperature junction to case (Tjc)
26.28 / 84 = 0.313°C/W. Junction to case thermal resistance (ΨJC)
Add the two together ΨCA + ΨJC = ΨJA
0.33 + 0.313 = 0.643°C/W. Junction to ambient thermal resistance (ΨJA)
So at 84W and local ambient of 45° we get a junction (core) temperature of 0.711 x 84 + 45 = 99°C
Now you can make ΨCA better by using a good TIM and a better cooler but we're stuck with ΨJC, barring removing the IHS.
IOW a CPU with a poor ΨJC but good cooler can run hotter using less power than a CPU with a good ΨJC.
Thanks for walking through these examples, at least we can say with updated values (for TCase and TDP from ark.intel) that for the 4790K the thermal resistance for Junction to Case should probably be lower than:
(ΨJC) < 99 - 74.04 / 88 = 0.2836 C/W
So:
1) TDP doesn't correlate to either real world or maximum power use.
2) TDP doesn't correlate to temperature in any meaningful way.
1) Who cares about peak maximum power use? Extreme OCers and motherboard makers perhaps. TDP as maximum sustained power use is meaningful. Well, PSU's need to be bigger than TDP, so this is a "caveat" at best.
2) TDP relates to temperatures in a simple linear fashion.
Temperature [°C] = Therm.Resist.[°C/W] * TDP [W] + Ambient [°C]