- Jan 27, 2001
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Originally posted by: cmdrdredd
it could just be a cost issue
Bottom line.Silicon Integrated Systems (SiS) will discontinue all production and development plans at 0.13 microns and below within its own facilities and may begin taking contract-manufacturing orders in the future, confirmed company chairman John Hsuan.
Hsuan, also CEO and vice chairman of United Microelectronics Corporation (UMC), was speaking at his first investors conference as chairman of SiS after UMC took a nearly 30% stake in the Taiwanese graphics chip maker last month.
SiS began 0.13-micron test production at its 8-inch fab in the first quarter of 2002 and had originally planned to produce graphics chips using 0.13-micron processes in the second half of that year, but plans were stalled once negotiations began with UMC last year.
Now, Hsuan wants to steer SiS toward more cooperation with UMC in advanced processes. The graphics chipmaker is expected to complete the first batch of wafer inputs for volume production at UMC in the second quarter. However, production at SiS?s own 8-inch fab will continue, though only up to the 0.15-micron node.
Asked whether UMC now plans to take over SiS?s fab operation, Hsuan stressed that the important point rather lies in raising SiS?s fab to a level of a dedicated foundry.
Meanwhile, Hsuan scrapped SiS?s old strategy of using low prices to grab market share, pointing out that the company?s gross margin fell from an average of 26% in 2001 to as low as 17% in the fourth quarter of 2002 and an average of 21% last year even though revenues grew 58% year-on-year.
Besides targeting profit this year, the new chief aims to lift gross margins to 30% with the help of UMC and a new focus on the high-quality, high-end market. Revenue is targeted at NT$20 billion this year.
Originally posted by: Wingznut
Looks like a very wise decision.
Was the move to .13µ a poor decision for nVidia? Obviously I don't know the details of why they've had difficulties in delivering NV30, but it does seem that the transition to .13µ is not going well for them.
Shrinking from .18µ to .13µ is significantly more challenging than previous process shrinks. And the upcoming process shrinks won't be any easier.
I'm hoping to skip .09µ and go right to .065µ. But, we'll see.Originally posted by: RaynorWolfcastle
Originally posted by: Wingznut
Looks like a very wise decision.
Was the move to .13µ a poor decision for nVidia? Obviously I don't know the details of why they've had difficulties in delivering NV30, but it does seem that the transition to .13µ is not going well for them.
Shrinking from .18µ to .13µ is significantly more challenging than previous process shrinks. And the upcoming process shrinks won't be any easier.
you'll tell us all about it when they transfer you to 0.09 µm mask development, right?![]()
Originally posted by: Wingznut
I'm hoping to skip .09µ and go right to .065µ. But, we'll see.Originally posted by: RaynorWolfcastle
Originally posted by: Wingznut
Looks like a very wise decision.
Was the move to .13µ a poor decision for nVidia? Obviously I don't know the details of why they've had difficulties in delivering NV30, but it does seem that the transition to .13µ is not going well for them.
Shrinking from .18µ to .13µ is significantly more challenging than previous process shrinks. And the upcoming process shrinks won't be any easier.
you'll tell us all about it when they transfer you to 0.09 µm mask development, right?![]()
![]()
Originally posted by: Yozza
They'll probably outsource future production to UMC instead of maintaining their own fab.
Originally posted by: velferdskiller
Originally posted by: Yozza
They'll probably outsource future production to UMC instead of maintaining their own fab.
They are staying with TSMC
Digitimes
[own emphasis added]Now, Hsuan wants to steer SiS toward more cooperation with UMC in advanced processes. The graphics chipmaker is expected to complete the first batch of wafer inputs for volume production at UMC in the second quarter.