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Lifer
- Nov 14, 2011
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superior in more than power draw?
Intel's also ahead in video decode.
superior in more than power draw?
With Raja on board, Arctic Sound has been "split into two", with the second side of the coin being the gaming market. He is said he wants to "enter the market with a bang".
That's exactly what came to my mind when reading the above quote. I sure hope Raja's bullish attitude results in a competitive product instead a bizarre ad.Is this "Poor Volta" Raja that we are talking about?
From the press release:I don't think Intel will aim high enough for their first gaming card. I expect a low end solution, like an upgrade card to replace an APU's graphics or something like that. Probably cost like $100. I don't expect them to actually impress anyone with their big bang market entry. That's the practical side of me.
The hopeful side is very excited and I'd absolutely LOVE to have a badass, high end Intel GPU to match whatever sick new 8 core CPU I buy from them for a future gaming rig. I like matching stuff and I'd love to go Intel for both CPU and GPU. I'd use blue themed décor and skulls everywhere. Like RGB skulls and stuff. BRING IT ON INTEL! Come on Raja! Don't blow it man. Push them HARD and make it happen!
Koduri will expand Intel’s leading position in integrated graphics for the PC market with high-end discrete graphics solutions for a broad range of computing segments.
The hopeful side is very excited and I'd absolutely LOVE to have a badass, high end Intel GPU to match whatever sick new 8 core CPU I buy from them for a future gaming rig.
Forget gaming, there's no way Intel is going to invest in that level of driver support.
But if we build a sea of x86 cores we wouldn't need driv......... oh wait..........Yeah, that's the biggest issue right now with Intel's IGP gaming - the lack of driver optimization (cheats).
Forget gaming, there's no way Intel is going to invest in that level of driver support.
Not to sound overly critical, but I don't remember them trying. Ever. They always talk a big game, but have never actually delivered on a single GPU design worth having. I think that if they were serious and actually trying, they would have had at least one competitive product in the past 40 years.
To be fair, they absolutely dominate the entry-level market with IGP.
I was thinking bugfixes and features but if driver optimization gets it to an acceptable framerate it wouldn't otherwise achieve, yeah they ought to think about that too.Yeah, that's the biggest issue right now with Intel's IGP gaming - the lack of driver optimization (cheats).
They did try with the first Iris Pro, they had the best performing IGP for a while, but at a price no one same would pay.
$300-$350 wasn't a bad price for the i7 at the time. The problem was severe limited quantities which increased prices, along with poor motherboard support.
Not to sound overly critical, but I don't remember them trying. Ever. They always talk a big game, but have never actually delivered on a single GPU design worth having. I think that if they were serious and actually trying, they would have had at least one competitive product in the past 40 years.
To be fair, they absolutely dominate the entry-level market with IGP.
Even if Intel would be able to summon magically fast gpu for gamers, moving to such card would be risky for consumer, as Intel really has horrible reputation when it comes to their divers. And unfortunately that reputation changes very slowly.
LOL. I'll believe Intel taking the "Gamer market by storm", when I actually see it. I'm not giving them any benefit of the doubt in this area, since they've tried MULTIPLE times, and FAILED.
Significant leaks: Intel working on true 3D packaging and Raja wants to enter dGPU "with a bang"
Next, on the packaging side, Ashraf has come with the major scoop that Intel is working on a 3D packaging technology called Fevoros, which will be able to package "smaller dies together as well as 3D stacking". It will be used post-Sapphire Rapids (so starting with 7nm Granite Rapids); EMIB will be used until SPR.
For some context as to what this significant news implies. It will be the successor of EMIB. EMIB is a 2.5D packaging technology that allowed for connecting dies (that are within um next to each other) with a low-power and very high-bandwidth interconnect (potentially over 4TB/s). EMIB's claim to fame and differentiator compared to the competition is that it doesn't use a very big (expensive) interposer, nor does it use yield-destroying TSVs (through silicon vias), but just a small embedded bridge in the package (as the name implies obviously).
Now, I have to say 3D stacking is already done: it is used in HBM. But as everyone knows Intel is not a DRAM manufacturer, so this implies that Intel is going to 3D stack logic dies (or 3D XPoint?). This would be a first. Everyone in the industry is interested in how well cooling of 3D stacked logic dies will go.
For comparison: 65nm interposers has 45 um bumps (these was used back in 2011). You probably forgot to mention this detail.I would guess that this will be an extension of EMIB: Intel is working on multiple generations of EMIB, for instance we know Falcon Mesa will use EMIB2, which will shrink the bump pitch to 35um from 55um for 2.5x the bandwidth, and Intel has previously said they were seeing as low as 10um in the labs.
Perhaps I'm showing my age a bit here, but I actually had an Intel i740 AGP card, one of the first AGP cards ever released. It was my first gaming PC, and it was much cheaper than the Voodoo 2 at the time, though performance was obviously a lot lower too. It still actually played games well though, and for a first attempt it wasn't bad, they never built on that though and kind of gave up.
http://www.tomshardware.com/reviews/graphic-chips-review-april-98,64-3.html