@Ajayhttps://www.globalfoundries.com/new...strys-leading-performance-offering-7nm-finfet
GF's 7nm FinFET technology will be supported by a full platform of foundation and complex intellectual property (IP), including an application-specific integrated circuit (ASIC) offering. Test chips with IP from lead customers have already started running in Fab 8. The technology is expected to be ready for customer product design starts in the second half of 2017, with ramp to risk production in early 2018.
imo GF 7nm will go into risk production by Q2 2018. We should expect actual HVM by early 2019. TSMC 7nm has a 9-12 month lead over GF 7nm. Samsung 7nm is EUV only so that should come later.
That is from September, in the new report in February they claimed to have advanced the process several months. I am not guessing, the official words are that they have HVM in Q2 2018. If they were brave enough to say that they will be early than reported before must be because things are going well on track ( let's see ).
