If you are adventurous, you could try getting a hacksaw and cut the baseplate into thirds, where you get rid of the middle section that has the welded heatsink, and use the end sections to cover the VRMs on either end of the card. You'd probably have to use the stick-on heatsinks for the memory chips, but they aren't as performance/heat-critical as the VRMs that will get very hot. But a smaller plate will have less surface area, so maybe use some stick-on heatsinks on top of the plate? I guess at some point you'll have diminshing returns as you add more layers on top of the VRMs, but I guess it also depends on your airflow.
But maybe you can try both configurations and see which does a better job keeping the VRMs cool.