Y'all may tire of it, but I wanna dish it out anyway.
The reviewer's approach was to OC a Prescott 2.8 to 4.06. I'm not quite sure how he does this -- he probably runs the memory on a divider, but then again, the test-bed includes the latest generation of mobos and uses DDR2 modules.
But to the point . . . . his purpose in OC'ing the testbed was to run up the thermal power to around 130 watts. You could still test these things without OC'ing the processor, or by OC'ing it less -- knowing what the thermal power would be under those less strenuous circumstances.
This presents a slight predicament for me, because I haven't yet experimented with my socket-478 3.2E Prescott to push it beyond 3.5 Ghz and FSB at 1,000 Mhz. Or -- for that matter -- 3.61 Ghz and FSB at about 892 Mhz. So it might look -- or seem -- as though I'm not submitting the equipment to the same stress as the X-Bit reviewer. Yet, I can't find any other logic that makes sense -- you could test it with lower thermal power or higher thermal power, but the idle and load values in conjunction with the thermal wattage would accurately rate and rank-order the coolers the same way.
As I said in other posts, my idle-load spread with an SI-120 on my Socket-478 Prescott is about 5.5C degrees. If the thermal power is only what INtel reports on their web-site -- 103 watts -- and doesn't vary that much from a slightly higher thermal power of my moderately over-clocked processor, this represents an extremely -- ridiculously -- low thermal resistance -- approximately 0.05 C/W. It hardly makes sense. But it's "real." It may have something to do with my "sinking" the Mosfets and PLLs, or with my motherboard duct. But my test with the XP-120 was entirely consistent with the review-reports of its thermal resistance. My tests with the SI-120 -- I've already explained. I'm insanely happy with it, but what gives here?
If the thermal power were higher, the thermal resistance would be even lower -- and seem even more ridiculous. Various reviews I've read for the Prescott I'm using -- keep in mind that there are probably some thermal differences between the socket-478 version and the LGA775 version -- show users who didn't over-clock getting idle values in the mid-40's (C) and load values well above 50C. Yet at 70F (21C) room temperature, my idle value is about 90F or 32C and my load value is 100F or 38C. These measurements were taken running PRIME95 Large FFT "extreme heat, stress. . . ." test. Maybe I'd see something else with S&M, but I doubt it would matter that much.
If we simply accept the imperatives of thermal resistance, we can find other comparisons between the reviewed coolers and the SI-120. For instance, we discovered that the Scythe Ninja with a fan running around 950 rpm exhibited a thermal resistance of about 0.19 C/W while the SI-120 with fan running at about the same speed showed 0.18 C/W. This would indicate an advantage for the SI-120 -- even a slight one -- qualified only by the choice of the "quiet" fan speed.
My real question is why -- in a review so recent -- did they exclude the SI-120? Everyone knows about ThermalRight; the XP-120 was a big hit last year -- that's why I've got one of those in another machine now -- a legacy from a year ago. It's not as though the company is "obscure" or nobody has heard of the product.
As for the other ThermalRight models -- like the XP90-C -- that's still a pretty damn good cooler, and it was something of a precursor for the SI-120, except that it's made entirely of copper -- correct me if I'm wrong. The TR for the XP90-C is something between 0.15 and 0.16 C/W. Just a shade less effective than the SI-120.
But to reiterate earlier insinuations -- it doesn't much matter if you over-clock the test-bed. Lower clock-speed -- lower thermal power; higher clock-speed -- higher thermal power. If you know the thermal power and you measure idle and load temperatures, you still have your index of performance. It won't change between a test-bed run at stock speed and a test-bed that is over-clocked.