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Radeon R9 380X ‘Fiji XT’ GPU Die Size 550mm²

Evreything except the die size is not news in the rumor mill. Although the 28 nm is one of the areas where I'd throw shade. Lisa herself has stated that they are going for 20 nm in selected GPU parts in Q2 and all the economics point to the fact that you'd need a high-margin part to justify the extra risk(ergo, dGPUs).

It'd be interesting if the numbers pan out. Wouldn't be the first time that AMD competed with Nvidia with a smaller die size.
The 780 Ti was at 533 mm^2 vs the 290X's 455 mm^2.
 
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Mondozei said:
Evreything except the die size is not news in the rumor mill. Although the 28 nm is one of the areas where I'd throw shade. Lisa herself has stated that they are going for 20 nm in selected GPU parts in Q2 and all the economics point to the fact that you'd need a high-margin part to justify the extra risk(ergo, dGPUs).

It'd be interesting if the numbers pan out. Wouldn't be the first time that AMD competed with Nvidia with a smaller die size. The 780 Ti was at 533 mm^2 vs the 290X's 455 mm^2.
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Lisa Su stated that the next gen GPUs are releasing in Q2. She did not say anything about the GPUs being 20nm. Thats misinformation which you are spreading. Its almost assured that AMD's R9 3xx GPUs are built at GF 28SHP (which is a high performance process designed specifically for AMD's product needs) with the partners Amkor providing the OSAT services (Out-Sourced Assembly and Test) and Hynix providing the HBM chips.

20nm is just not going to happen for high performance chips such as GPUs and CPUs. Only low power mobile SOCs like Apple A8 and A8X chips will be manufactured at this node.
 
Mondozei said:
Evreything except the die size is not news in the rumor mill.
Click to expand...

Actually the 550mm die size has been on the rumor mill longer than any other rumors. I forget the AMD partner, but they leaked they finished a design for a 550mm AMD GPU part.
 
If it was 28nm it probably would already be out. Look at what nvidia has done by designing for 28nm.
 
Mondozei said:
The 780 Ti was at 533 mm^2 vs the 290X's 455 mm^2.
Click to expand...

Slight correction:

780Ti = 561mm2
290X = 438mm2

AMD moving from 438mm2 to 550mm2 is a 25.5% increase in die size.
NV moving from 561mm2 to say 620mm2 is an 10.5% increase in die size.

AMD actually quoted a 352mm2 die size for Tahiti XT despite GPU-Z reporting about 365mm2.

Efficiency.jpg


Going from 352mm2 7970Ghz to a 438mm2 R9 290X is a 35% increase in performance with a 24.4% increase in die size. If R9 380X is 550mm2, it should automatically have 35% more perfomrance over the 290X, if AMD manages to reduce power usage.

Anything extra will come from the improvements in improvements in efficiency (for example more tightly grouped GCN cores, larger L2 cache, more efficient TMUs, ROPs and SPs), and memory bandwidth and latency reduction efficiencies (HBM). I would say 45-50% over the R9 290X isn't out out f the question at 300W power usage. Anything beyond that sounds like some magical AMD engineering voodoo on 28nm. :awe:
 
RussianSensation said:
Slight correction:

780Ti = 561mm2
290X = 438mm2

...:
Click to expand...

When you think about the fact that the 290x was on a die about 22% smaller, its a little awesome that they are so close in perf.

If AMD can put out a chip that is equal in size to Nvidia, its quite possible to get equal to better perf/$.
 
So in addition to ~550mm2 new high end they have a ~350+ mm2 Tahiti/Tonga replacement in the works, it seems.

I'd doubt the smaller die is paired with HBM so why haven't we seen AMD launch it to counter the 970 hammer Nvidia dropped? Has AMD ever managed a tight release schedule?
 
Vesku said:
So in addition to ~550mm2 new high end they have a ~350+ mm2 Tahiti/Tonga replacement in the works, it seems.

I'd doubt the smaller die is paired with HBM so why haven't we seen AMD launch it to counter the 970 hammer Nvidia dropped? Has AMD ever managed a tight release schedule?
Click to expand...

I think the quoted 350mm IS in fact Tonga. This slide is pretty old
 
Wouldn't that point to the 550mm2 die just being big Tonga? If so HBM better provide quite a reduction in power use for their 380/390 to be at all interesting.
 
Yea that 350mm2+ die should be Tonga, but current R9 285 is not a full Tonga. Im expecting a full Tonga with HBM in the near future to take on GTX970-980.
 
Vesku said:
Wouldn't that point to the 550mm2 die just being big Tonga? If so HBM better provide quite a reduction in power use for their 380/390 to be at all interesting.
Click to expand...

If by big Tonga you mean a GCN 1.2 update to Hawaii with more shaders, then yes that is most likely what Fiji will be
 
Vesku said:
So in addition to ~550mm2 new high end they have a ~350+ mm2 Tahiti/Tonga replacement in the works, it seems.

I'd doubt the smaller die is paired with HBM so why haven't we seen AMD launch it to counter the 970 hammer Nvidia dropped?
Click to expand...

What makes you assume that AMD will not have HBM across their product stack (atleast USD 300 and above). I can see AMD using HBM in the R9 380, R9 380X, R9 390 and R9 390X. My guess is the 4096 sp chip will be their top of the line R9 390X Bermuda XT (which will be 60 - 65% faster than R9 290X) which will also be their compute flagship. There will be a smaller chip with a focus on gaming performance and efficiency with 3072 sp which could be Fiji XT aka R9 380X. Right now its all speculation but its looking very much that AMD will have a very competitive product stack by late Q2.

http://www.guru3d.com/news-story/amd-fijixt-bermuda-xt-makes-mystery-appearance.html


Has AMD ever managed a tight release schedule?
Click to expand...
Yes they have launched an entire GPU stack in 2 months flat. It would not surprise me if the entire R9 3xx series is launched in Q2.

HD 7970 - Jan 9, 2012 (press reviews went up on Dec 22, 2001 but retail availability was on Jan 9, 2012)
http://www.anandtech.com/show/5261/amd-radeon-hd-7970-review
http://www.anandtech.com/show/5314/...-double-dissipation-the-first-semicustom-7970

HD 7770 - Feb 15, 2012
http://www.anandtech.com/show/5541/amd-radeon-hd-7750-radeon-hd-7770-ghz-edition-review

HD 7870 - Mar 6, 2012
http://www.anandtech.com/show/5625/...-hd-7850-review-rounding-out-southern-islands
 
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AtenRa said:
Yea that 350mm2+ die should be Tonga, but current R9 285 is not a full Tonga. Im expecting a full Tonga with HBM in the near future to take on GTX970-980.
Click to expand...

HBM is connected to the die with completely different interconnect. It's extremely unlikely that there is a hidden unused HBM interconnect in Tonga.
 
Tuna-Fish said:
HBM is connected to the die with completely different interconnect. It's extremely unlikely that there is a hidden unused HBM interconnect in Tonga.
Click to expand...
+

Best thing I can say is wait and see and stop making assumptions based on current arch. We have no idea how different the arch is and the components transistor allocation for the next GPUs.
 
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