I don't disagree with Zepper.
The issue of pressure is a relative one of "stocks and flows". If I'm putting more air into the case at a margin (emphasis) than I'm taking out, then air density is slightly higher. But if my exhaust CFM's are relatively healthy, pressurizing the case slightly is not going to cause a buildup of heat.
I think this becomes clearer if you look at the "ducting mod" idea. In that case (situation ha), pressure in most of the case is slightly above room-air-pressure, owing to the intake fans. Your CPU fan is drawing this same pressurized air into the heatsink, and it is for the most part sequestered to the duct area as long as the exhaust fans are sucking air out of the motherboard duct at about the rate that it is getting sucked in by the CPU fan from the rest of the case and the intake-fan-air. Here, you are removing heat before it gets a chance to circulate among the molecules of the remaining air of the computer case interior. If there are stagnant zones, they may be "relatively" stagnant, but they are not absorbing heat to any significant degree.
sodChaos is correct that this is a matter of pressures "at the margin", since we are not creating a circuit-board-frying vacuum, nor are we pressurizing to such a degree that there is any significant build-up of stagnant air. We are just increasing air pressure within the case so that it is slightly higher than the air-pressure in the room. We are exhausting air at a slightly slower rate than we are bringing it in, but this does not lead to an infinite build-up of stagnant air. The source of the pressure is colder intake air.
I sold my CoolerMaster Wavemaster case to my dentist because it would have required too much work and modification to make it cooler. What I think would work with the WaveMaster is a sealed intake fan of larger than 80mm size that does not recycle interior case air like the stock fans and mountings of the WaveMaster actually do. Then, I would widen the exhaust fan hole to 92mm. If it were possible, I'd make both intake and exhaust in the WaveMaster a choice of 120mm fans, but those familiar with the WM know how tricky that would be. There would be no need for a blow-hole CPU-intake duct, and you could use the window-panel case-mod sold by CM. Foam-board ducting over the motherboard would complete the cooling.
I can only offer the description of the proven regime of fans I use now in my cases, which are exclusively full-tower models -- recycled from older computers -- since I sold the CM WM. Two 120mm intake fans at a minimum 1,500rpm (although one would probably suffice); a 120mm CPU fan defaulting to 2,000rpm at idle but capable of 3,100 rpm and 108CFM at CPU-load; two 92mm exhaust fans defaulted to 2,500rpm each, which spin up to around 3,000 to 3,200 at load.
Potentially the twin exhaust fans can provide as much as 75CFM each at load, if run at 3,600rpm (with noise). And I had to choose 92mm exhaust instead of 120mm (single or dual) because of the original case-design of the "recycled" case I chose to use for this build -- a 1995 Gateway2000 full-tower (early-)ATX.
At a 22% over-clock for a 3.0C Pentium4 @ 3.70 Ghz, 247 Mhz ext. frq. and 988 Mhz FSB, FX5950 Ultra AGP, dual Hitachi 7K250 RAID0 (ICH5), here are my temperatures at a room temperature of 70F, with load-testing under PRIME95's prime number search and "blend" test:
idle
CPU 79F / 26C
motherboard 75F / 24C
NorthBridge (thermal sensor) 87F / 30.5C
AGP (thermal sensor) 88F / 31C
AGP (nVidia internal sensor) GPU = 33C ; "ambient" = 27C
load (PRIME95)
CPU 110F / 43C
motherboard 79F / 26C
NorthBridge (thermal sensor) 90F / 32C
AGP (thermal sensor) 89F / 31.6C
AGP (nVidia internal sensor from display "properties") GPU = 34C; "ambient" = 28C
The ducting mod is responsible for the narrow range of motherboard and chipset idle and load values. PRIME95 should not have such an effect on the AGP card, so I only note here that the AGP temps never, ever exceed 40C under graphic-intensive load situations or significantly higher room temperatures with similar load situations. Ducting impact on the CPU load temperature was a matter of 2 to 4C cooler than without the duct. Without the ducting mod, the chipset temperature has been seen to reach 40C under load.