• We’re currently investigating an issue related to the forum theme and styling that is impacting page layout and visual formatting. The problem has been identified, and we are actively working on a resolution. There is no impact to user data or functionality, this is strictly a front-end display issue. We’ll post an update once the fix has been deployed. Thanks for your patience while we get this sorted.

p2 266 question

you'll be fine at 5 secs because there is a heatplate attached to it. remove the heatplate and you'll have a whole different story.
 
You don't REALLY want to run that without a sink... If you have one of the .25 micron units, that is at least a 400MHz processor. It is an easy 300-338 even if it is the older Klamath .35 micron process. Why fry it?

Nack
 
I agree with everyone else, don't use it without a heatsink & fan, you shouldn't be running anything faster than 150mhz without a little cooling.

I reckon you could push that to 350mhz (3.5 x 100mhz), but could be a bit risky and you would need a nice sized slot 1 fan.
 
as a data point, ive been running a 266 (66 FSB) @400 (4x100) for years now, stock retail HSF w/NP. YMMV, but yeah, most of these seem to oc quite high, well over 400...like Nack said, these are probably "remarked" 400's to begin with (400's or higher that tested on the outside of the statistical stability curve, and remarked/certified as 266's).

[Edit] Oh yeah, forgot to add, it is one of the .25 die cores.
 
I ran it yesterday for about 30 seconds with only by hand as a heatsink (holding it basically)
Didn't warm up that bad...maybe hitting 40c?
I'm guessing it's a 0.25 process then...
 
Back
Top