- Jun 18, 2000
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http://www2.marketwatch.com/quotes/articles.asp?symb=TDFX&sid=42639&source=htx/http2_mw&guid={EB809777-3B10-4907-97ED-1727768EB31C}
I don't quite understand this new tech exactly. Could somebody more knowledgeable in the subject explain it, please? A couple interesting tidbits caught my attention.
<< --16 high frequency series/parallel termination channels >>
Is that something like a Rambus's dual-channel interleaving? Could 3dfx be dumping the dual-chip solution in favor of a memory interleaving tech to achieve the same bandwith? It would be a good idea. That way, a single chip board would be the competitive mainstream solution and the dual-chip would be the monster.
<< This chip was originally designed by CAMD in conjunction with the hardware engineers at 3Dfx Interactive, Inc. >>
Apparently, 3dfx engineers have had a hand in developing this. If this is going to be incorporated into Rampage-based solutions, then I have to give props to 3dfx for really going all out for their new architecture.
			
			I don't quite understand this new tech exactly. Could somebody more knowledgeable in the subject explain it, please? A couple interesting tidbits caught my attention.
<< --16 high frequency series/parallel termination channels >>
Is that something like a Rambus's dual-channel interleaving? Could 3dfx be dumping the dual-chip solution in favor of a memory interleaving tech to achieve the same bandwith? It would be a good idea. That way, a single chip board would be the competitive mainstream solution and the dual-chip would be the monster.
<< This chip was originally designed by CAMD in conjunction with the hardware engineers at 3Dfx Interactive, Inc. >>
Apparently, 3dfx engineers have had a hand in developing this. If this is going to be incorporated into Rampage-based solutions, then I have to give props to 3dfx for really going all out for their new architecture.
 
				
		 
			 
 
		 
 
		 
 
		 
 
		 
 
		
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