taltamir
Lifer
- Mar 21, 2004
- 13,576
- 6
- 76
I think his postulations is one chip that contains multi die. Cut down each die to 1/4th of the size and put four of them on a single chip. Getting better yeilds as a result...
Interestingly enough, most prvious generation cards contain a second tiny die (1/15th the size of main die) containing the HDCP logic circuitry on the same chip. Rather then it being built in to the main die.
Thanks for that article about sony... shame on them. But what can they do, 10 to 20% yields are just painful. You would think they will be on the forefront of fabrication processess because of it, making 45nm chips... but for reason not...
Interestingly enough, most prvious generation cards contain a second tiny die (1/15th the size of main die) containing the HDCP logic circuitry on the same chip. Rather then it being built in to the main die.
Thanks for that article about sony... shame on them. But what can they do, 10 to 20% yields are just painful. You would think they will be on the forefront of fabrication processess because of it, making 45nm chips... but for reason not...
