>><< How does one go about rating the quality of the components? Is it purely >>subjective or are some said components known to be better than others? You really >>sound like you know your stuff.......i just wanna know also...=) >>
>You unweld the components and test their capacity and their througput, as well as >their stamina and how they secure of the voltage holding... then you test the >signalling quality within a magnetic resistance chamber where each component has >to deliver the exact amount of data throughput... then you do a electronic circuit >conductive test and check out the conductivity of each signalling line per trace >of the circuits and the trace lines of the motherboard...
Would it not be better to unsolder solder joints instead of unwelding?
Capacity and throughput are used when judging data rates, more suitable
for testing chipsets, system level, and tranceivers.
Magnetic resistance chamber?!? LOL
How about a EMI chamber for measuring radiation/susceptibility?
Conductive test? Humm...I could stretch this a little and call it
a resistive test or conductance test, not to critical for data lines,
except for shorts/opens, or wonder about voltage drops due to the
resistance of the traces to components which draw a high current, thus
causing a voltage drop on the way to say, the CPU...
How about talking about capacitors and their ESR ratings? Or
about how long a given capacitor will last, especially electrolytics?
OS-CON caps are pretty decent. Tantalums are better in some ways,
if you know how to design with them properly, especially in cold
environments where the electolyte gets too cold to function properly.
Whatever happened to basic reliability tests like vibration and
thermal extremes and thermal shock testing? We could go a little further
and talk about HALT/HASS testing.
Shoot, just look at the board, and see how well the toroid inductors
are wound.
Ever check out the onboard regulators and how well they respond, whether
they can handle the rated load or even transient response? Or foldback
response in the case of a short.
How about looking at the soldering and judging the quatity per IPC or
J-STD-2000?
Or you could look at how well components like large electrolytic
capacitors are mounted on a board, a big no-no is to stick those
things vertically like most motherboard makers on the market do,
and then have nothing to support them. Not good.
Didn't intend to flame you, your help in the forum is great, and
especially your patience. Free tech support, can't beat that.
My hats off to you in the support area. Some of the reasoning is
a bit thin for me, but I can't shake a stick at the MSI K7T Pro2-A.
Boy, motherboard makers sure are making boards thin (4 layers) these
days, aren't they? Sheesh, and I remember 6 and 8 layer small AT
form factor boards. Amazing there isn't more boards returned due
to flexing, as large as they are.