Via and M$ - This would be a brilliant combination.
Think about it guys.
Via has a graphics core division (S3) which is developing a new high speed graphics core called the Coumbia that will be produced with a .13m process. This core is supposed to compete with high end cards from nVidia and ATi according to the PR drivel.
More importantly, it will have a DX9 compatible. As we now know for console gaming, feature sets are becoming more important than brute speed because resolution is not really the issue on standard TV's.
Via also has a CPU - the C3 - manufactured on the .13 micron process as well. This bad boy does not need a fan yet puts out some impressive processing power.
Via is also making its own boards now... Do you see how they could be an ideal partner for M$?
What is the Xbox's problem technologically speaking? Heat.
Advantage - VIA. Most of the parts rolling off of the Via line nowadays are designed to require only passive cooling. While PC enthusiasts may scoff, that is an awesome advantage in a crampt non-ventilated console. To have that kind of power available with minimal cooling means a higher MTBF logically for most of the system, reducing repair costs for M$, and increasing the longevity of the system - allowing M$ to seel more games to happy customers for years to come.
It is all about economies of scale and volume purchasing. Via is in a position to provide an integrated board with video and CPU - all Via for a fraction of what a competing nVidia and Intel solution will cost.