Could this be related to some LP type of transistors? And how would you interpret these ES P-State definitions:
Code:
P-State FID 0x14 - VID 0x0B - IDD 12 (18.00x - 1.412 V)
P-State FID 0xE - VID 0x0E - IDD 10 (15.00x - 1.375 V)
P-State FID 0xA - VID 0x16 - IDD 10 (13.00x - 1.275 V)
P-State FID 0x7 - VID 0x1B - IDD 9 (11.50x - 1.212 V)
P-State FID 0x4 - VID 0x21 - IDD 8 (10.00x - 1.137 V)
P-State FID 0x1 - VID 0x26 - IDD 6 (8.50x - 1.075 V)
P-State FID 0x10C - VID 0x30 - IDD 6 (7.00x - 0.950 V)
Could IDD stand for specific levels of max. current? I noticed a relatively big jump in voltage going from 3rd to 2nd entry, while IDD stays the same.
Yeah those IDD's can't be actual current draws (in amps), the numbers are too low by a factor ten to even be in the ballpark.
Further, as you noted, any change in operating frequency is going to result in a change in current draw. But the 2nd to 3rd entry changes involve a change in the multiplier from 13x to 15x which would drive a change in the current draw.
So if IDD represented current then there should be a notable change in the IDD value for those two P-States.
I really don't know what would be pushing the power-consumption to higher levels other than the generic observation that gate-first HKMG integration is a trade-off of having higher gate density with lower drive-currents versus that of a gate-last integration scheme.
To make up for the lowered drive currents you must dial up the Vcc accordingly such that you achieve the necessary drive currents to satisfy your clockspeed aspirations.
Intel's gate-last integration scheme gives it an intrinsically higher drive-current for a given operating voltage meaning they can set the operating voltage lower while attaining a given clockspeed (for a given circuit, all things considered equal), but that comes at the expense of an intrinsically lower gate-density (fewer chips per wafer).
What we don't know is how much of this fundamental device physics limitations are in play versus how much of what we are seeing is simply nothing more than your basic garden variety "new node maturity" teething problems.
This is where AMD's (now GloFo's) well known and well respected APC (advanced process control) will be brought to bear and make a critical difference in the node's rate of maturation. Thinking of the difference between those initial PhII X4's and the successor PhII X6's that had higher clocks and more cores but not higher power-consumption.