All this discussion of "thin" and "caked" has me worried now.
We actually did put a lot of AS3 on when we installed the SLK-800 on the 1700+, more than we put on our first one. The "caked" one is running around 40C (high) and is a T-B, while the 1600+ is a Palamino and runs at 50C or so.
I realize they are on different boards (the 1700 on an EPOX-8RDA+ and the 1600 on a ABIT KRD7-A Raid), and that they are different CPU types (Thoroughbred B vs. Palimino), but I realy hate to try and remove the Heat Sink/Fan when the temps are indicating what they are (as long as they are approximately correct).
Why? Its because I had so much trouble connecting the SLK-800 to the CPU and was even concerned that I might crack the CPU with all the pressure it took to snap that puppy into place. This was only our second build, and the first with this heatsink. Several times the darn screwdriver slipped off to hit the motherboard while I was trying to snap it into place. It just seemed soooo tight.
It has been running smoothly since I built it, and even after I transferred all of it to another case last weekend, that I hate to fix something that ain't broke.
I am running the thermometer in the background and constantly check the temps, and it has never gotten higher than 40 degrees C. The new ANTEC SX835 case has a lot of cooling capability too.
Does everyone agree that I should let it rest - unless I see spikes in the temps - or, should I open a can of worms and scrape off the excess icing?
Thanks!