The fan on my Toshiba M15-S405 laptop seemed to be running more frequently than normal so I decided to take a peek at the cpu heat-pipe fins for dust build-up. I removed the access panel and the fins appeared to be debris-free. I noticed that the clamp down mechanism for the cpu HSF was kind of sloppy, so I removed the bolts holding in down and decided to have a look at the thermal interface between the cpu and the HSF.
I got an eyeful. There was no thin layer of TIM, but there was a huge amount of paste slopped all over the cpu core about the size of a jelly bean (probably 30 times more than needed). I couldn't beleive that is the way they come out of the factory.
Needless to say, I blew the fins out, cleaned up the HSF and the core and then applied a small amount of Arctic Silver 5 and clamped it down tight. The result was positive. The fan runs for a much shorter period of time and the heat transfer will get better with time as is the case with AS5. I will undoubtedly have a cooler running cpu and the machine may just last a little longer. I wish I had checked this immediately after purchase, but will on my next portable. Just thought I'd share my experience.....
m
I got an eyeful. There was no thin layer of TIM, but there was a huge amount of paste slopped all over the cpu core about the size of a jelly bean (probably 30 times more than needed). I couldn't beleive that is the way they come out of the factory.
Needless to say, I blew the fins out, cleaned up the HSF and the core and then applied a small amount of Arctic Silver 5 and clamped it down tight. The result was positive. The fan runs for a much shorter period of time and the heat transfer will get better with time as is the case with AS5. I will undoubtedly have a cooler running cpu and the machine may just last a little longer. I wish I had checked this immediately after purchase, but will on my next portable. Just thought I'd share my experience.....
m
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