Lapping question

[hypeMarked]

I have a couple question about lapping. The more I read the more confused I get. For example, there are guides that recommend lapping both the HSF and the CPU, but sites like SVC.com's guide mentions to not lap a "bare" CPU. Anyways, here are my questions:

1. How do you lap a CPU correctly? (CPU with pins sticking out and w/out pins - e.g. LGA type). Do you put a piece of square foam on it and start moving it around?

2. I've seen that some people said that Thermalright HSF are all copper based but are coated with aluminum or something and we must remove it. So, I have the ultra 120 eTreme, should I just sand it until I see the copper base?

Thanks,

EDIT: Crap, I forgot I was in the wrong forum, please move if possible. Thanks

 

[cmdrdredd]

there was a guide online somewhere that I used before. I can't locate it now though. Try searching on google.

edit: found this http://www.cyberitforums.com/index.php?page=7

 

[Ika]

When I lapped my E6420, I put on the black plastic protector piece to keep me from owning the pin contacts, then started at it with 320 grit paper until I wore down the nickel, then went to 500, 600, 800, 1200, then 4000 🙂D).

My heatsink had an exposed copper base, but some heatsinks (like TR, I guess) have some sort of coating (probably nickel, like Intel IHSs) to keep it from... oxidizing? Something like that.