Lapping is a procedure you are better off not knowing about. It worked great on PPGA CPUs where there was some metal there before the core, but with FC-PGA and AMD Tbirds and Durons, you are lapping the direct silicon, once you break the clear coat.
It is typically used to creat a perfectly flat mirror finish on contact surfaces, eliminating air gaps, so a heatsink can make perfect, flat contact, for best cooling. This is done by using a flat surface and progressively finer grades of sand paper, wet/dry. Good Paste like Arctic Silver helps eliminate this non-conformity. It's not worth the risk. Don't screw with it.
Discussion Zen 5 Speculation (EPYC Turin and Strix Point/Granite Ridge - Ryzen 9000)
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